-
RFH 355nm all solid-state UV laser cutting silicon wafer
Feb 04 , 2021
RFH 355nm all solid-state UV laser cutting silicon wafer RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor intro...
view more
-
355nm UV laser has little thermal effect and is used for cutting silicon wafers
Feb 04 , 2021
RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor introduces a very powerful material to everyone. Its element i...
view more
-
Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed
Feb 04 , 2021
Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor introduces a very powerful material to everyone. Its element is the second most abundant element in the earth's crust, accounting for 26.4% of the...
view more
-
Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
view more
-
Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
view more
-
uv Laser systems for wafer serialization, marking and scribing
Apr 27 , 2021
Semiconductor wafer processing typically requires serialization, patterning and roughening operations. And picking the correct laser system for these operations can be complex once you consider all the relevant process variables—such as substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput and clean room protocols. Whether marking or cutting wafers, lasers ...
view more
-
CO2 Laser Marking Glass wafers,Weatherstripping,Electronic PCBs
Apr 30 , 2021
CO2 Laser Marking On this page, we explain marking examples and characteristics of CO2 laser markers, which are perfect for applications such as marking resin and paper or processing films. Applications Mechanism and Characteristics of CO2 Lasers Product Introduction Applications CO2 lasers have the longest wavelength of all commonly used lasers, more than ten times longer than that of stan...
view more
-
Why choose UV laser cutting machine for wafer cutting
May 17 , 2021
Why choose UV laser cutting machine for wafer cutting Most semiconductor materials have a good absorption of light in the ultraviolet band. Take the absorption of monocrystalline silicon in different wavelength bands as an example. When laser processing in the ultraviolet band is used to process semiconductor materials, due to the narrow focus spot of ultraviolet light, the photon energy is ...
view more
-
How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
view more
-
Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
view more
-
Laser cutting sapphire LED chip
May 21 , 2021
Laser cutting sapphire LED chip The development of LED chips continues to develop in the direction of high efficiency and high brightness. Traditional chip cutting methods such as diamond scribing and grinding wheel sawing are gradually outdated due to their low efficiency and low yield, and cannot meet the needs of modern production. At present, laser cutting met...
view more
-
Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
view more
