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3W water-cooled laser is especially suitable for marking Apple data lines
Jun 01 , 2021
3W water-cooled laser is especially suitable for marking Apple data lines The complete system of 3W water-cooled laser + power supply + cooler ensures the quality of data line marking Apple data line marking generally chooses 3W water-cooled laser "Which type of laser is generally used for marking Apple data lines? Water-cooled or air-cooled" the customer asked "Most data cables are made of...
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Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed
Jun 01 , 2021
Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photo...
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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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Industrial application of infrared picosecond laser cutting machine
Jun 04 , 2021
Industrial application of infrared picosecond laser cutting machine At present, the manufacturing industry has entered the "light" era. From nanoseconds, picoseconds, and femtoseconds, people's exploration of laser technology has never stopped. Ultrafast laser refers to a laser whose pulse time width is on the order of femtoseconds or picoseconds. It vaporizes materials instantaneously by v...
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S9 UV solid-state laser marks on the LED plastic shell without blurring
Jun 07 , 2021
S9 UV solid-state laser marks on the LED plastic shell without blurring Ultraviolet laser high-precision engraving of intelligent building intercom system LED plastic panel S9 UV laser allows users to achieve fine marking without having to make a large optical path LED plastic shells exist in all aspects of our lives, for example, they are widely used in smart intercom systems and sw...
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532nm green laser is used for micro-holes and blind holes on silicon wafers
Jun 08 , 2021
532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers With a 532nm green laser, the marking of silicon wafers is clearer The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the ma...
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RFH 355nm UV laser is particularly good at wafer cutting and scribing
Jun 28 , 2021
RFH UV laser is the main light source of wafer laser scribing machine Wafer laser scribing machine manufacturers buy RFH UV lasers in bulk RFH 355nm UV laser is particularly good at wafer cutting and scribing The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the material of the quartz semiconductor for the m...
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RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers
Jun 30 , 2021
RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers RFH nanosecond UV laser makes precise wafer cutting possible Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocr...
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35W green laser is used for the processing of micro-holes and blind holes of silicon wafers
Jul 14 , 2021
35W green laser is used for the processing of micro-holes and blind holes of silicon wafers The leader in silicon wafer microvia and blind hole processing-RFH green laser On-site inspection of RFH green lasers for silicon wafer microvia and blind hole processing customers Wafers are purified by silicon elements, and pure silicon is made into growing silicon ingots, which become a quartz sem...
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355nm UV laser cuts, drills, and scribes on glass wafers
Jul 19 , 2021
355nm UV laser cuts, drills, and scribes on glass wafers RFH nanosecond UV lasers are well received in wafer cutting RFH UV laser is a great technology for cutting/punching/grooving silicon wafers and silicon wafers Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials s...
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15W high power UV laser cutting LED particle PCB circuit board without burrs
Jul 22 , 2021
15W high power UV laser cutting LED particle PCB circuit board without burrs 15W UV laser cutting PCB circuit board in one-time molding, saving time and effort RFH UV lasers undoubtedly bring greater market and hope for PCB circuit boards PCB board, also called printed circuit board, is an important electronic component and a support for electronic components. It is widely used in many elec...
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