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RFH 355nm all solid-state UV laser cutting silicon wafer
Feb 04 , 2021
RFH 355nm all solid-state UV laser cutting silicon wafer RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor intro...
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355nm UV laser has little thermal effect and is used for cutting silicon wafers
Feb 04 , 2021
RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor introduces a very powerful material to everyone. Its element i...
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Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed
Feb 04 , 2021
Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor introduces a very powerful material to everyone. Its element is the second most abundant element in the earth's crust, accounting for 26.4% of the...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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CO2 Laser Marking Glass wafers,Weatherstripping,Electronic PCBs
Apr 30 , 2021
CO2 Laser Marking On this page, we explain marking examples and characteristics of CO2 laser markers, which are perfect for applications such as marking resin and paper or processing films. Applications Mechanism and Characteristics of CO2 Lasers Product Introduction Applications CO2 lasers have the longest wavelength of all commonly used lasers, more than ten times longer than that of stan...
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How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
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Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed
Jun 01 , 2021
Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photo...
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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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532nm green laser is used for micro-holes and blind holes on silicon wafers
Jun 08 , 2021
532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers With a 532nm green laser, the marking of silicon wafers is clearer The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the ma...
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RFH UV laser cuts earphone film to improve music quality
Jun 18 , 2021
RFH UV laser cuts earphone film to improve music quality With the development of the social age, our perception of headphones has undergone different changes. At first, I was afraid of disturbing others by wearing headphones, but now I am afraid of disturbing others. More and more young people choose to wear headphones and enjoy them in public. This phenomenon has led to the rapid expansion of the...
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RFH 355nm UV laser cuts the tempered film with smooth and uniform edges
Jun 23 , 2021
RFH UV laser high-speed, perfect cutting, perforating mobile phone tempered glass film Fully digital control technology, RFH ultraviolet laser is loved by mobile phone tempered film manufacturers RFH 355nm UV laser cuts the tempered film with smooth and uniform edges With the widespread application of touch screen mobile phones in daily life, the application of mobile phone tempered glass f...
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