Why choose UV laser cutting machine for wafer cutting

 Most semiconductor materials have a good absorption of light in the ultraviolet band. Take the absorption of monocrystalline silicon in different wavelength bands as an example. When laser processing in the ultraviolet band is used to process semiconductor materials, due to the narrow focus spot of ultraviolet light, the photon energy is relatively high. High, can break the chemical bond of the material. The volume of the space occupied by the product expands rapidly, and finally shoots and separates the parent body in the form of a bulk explosion and takes away the excess energy. The hot zone has little effect. In this process, since there is no heat generated, the process of ultraviolet laser is also called "cold working". After the cutting is completed, each chip is separated by the corresponding split process.

       Since the energy of this special wavelength and frequency laser acting on the material to be processed is only a few watts or even milliwatts, there is no molten material on the outside or inside, and the front and back sides are almost invisible with the eyes. , This provides a larger space for chip manufacturers to reduce the width of the cutting channel and increase the number of chips per unit area to reduce costs. Since the short-wavelength ultraviolet laser has almost no thermal damage, the material does not need to be cooled, and the entire cutting process is performed in a completely dry environment. The molten material is also vaporized, so the appearance of the material is not contaminated at all, which also solves the problem of contamination of semiconductor wafers.

       Ultraviolet laser applications in the field of semiconductor chip processing mainly include: chip cutting, wafer drilling micro-holes, wafer marking, laser adjustment of thin film resistance, laser measurement, laser etching, deep ultraviolet projection lithography, etc. In application, in order to adapt to the continuous development of large-scale production, from the perspective of output and cost, traditional die separation technology is no longer practical. UV laser cutting technology will become an application with great potential, and it will become this type of application. Key technology.