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RFH 355nm all solid-state UV laser cutting silicon wafer
Feb 04 , 2021
RFH 355nm all solid-state UV laser cutting silicon wafer RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor intro...
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355nm UV laser has little thermal effect and is used for cutting silicon wafers
Feb 04 , 2021
RFH 355nm UV laser has little thermal effect and is used for cutting silicon wafers Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor introduces a very powerful material to everyone. Its element i...
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Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed
Feb 04 , 2021
Ultraviolet laser cuts silicon wafers with fine cutting and fast cutting speed RFH Nanosecond Ultraviolet Laser: Good technology makes good silicon wafers, good silicon wafers make a powerful country's microelectronics technology Today, RFH Laser Editor introduces a very powerful material to everyone. Its element is the second most abundant element in the earth's crust, accounting for 26.4% of the...
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RFH 355nm UV laser drilling holes in plastic
Feb 07 , 2021
RFH 355nm UV laser drilling holes in plastic Now, many laser processing technologies have been applied to many industries, such as laser cutting, laser marking, and laser engraving. Among them, laser drilling technology is the first laser processing technology to achieve practical production. Laser pro and dural drilling takes both into processing efficiency, and can bring good economic ben...
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Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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uv Laser systems for wafer serialization, marking and scribing
Apr 27 , 2021
Semiconductor wafer processing typically requires serialization, patterning and roughening operations. And picking the correct laser system for these operations can be complex once you consider all the relevant process variables—such as substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput and clean room protocols. Whether marking or cutting wafers, lasers ...
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CO2 Laser Marking Glass wafers,Weatherstripping,Electronic PCBs
Apr 30 , 2021
CO2 Laser Marking On this page, we explain marking examples and characteristics of CO2 laser markers, which are perfect for applications such as marking resin and paper or processing films. Applications Mechanism and Characteristics of CO2 Lasers Product Introduction Applications CO2 lasers have the longest wavelength of all commonly used lasers, more than ten times longer than that of stan...
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Hole Drilling by Laser
May 06 , 2021
Hole Drilling by Laser This section introduces laser processing-based drilling through examples. Basic principles of drilling using laser markers Hole drilling example — Drilling holes in rice bags Recommended models for hole drilling, organised by material Basic principles of drilling using laser markers Laser-based drilling uses laser light to irradiate a single point of a target in...
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Why choose UV laser cutting machine for wafer cutting
May 17 , 2021
Why choose UV laser cutting machine for wafer cutting Most semiconductor materials have a good absorption of light in the ultraviolet band. Take the absorption of monocrystalline silicon in different wavelength bands as an example. When laser processing in the ultraviolet band is used to process semiconductor materials, due to the narrow focus spot of ultraviolet light, the photon energy is ...
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How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
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