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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed
Jun 01 , 2021
Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photo...
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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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Industrial application of infrared picosecond laser cutting machine
Jun 04 , 2021
Industrial application of infrared picosecond laser cutting machine At present, the manufacturing industry has entered the "light" era. From nanoseconds, picoseconds, and femtoseconds, people's exploration of laser technology has never stopped. Ultrafast laser refers to a laser whose pulse time width is on the order of femtoseconds or picoseconds. It vaporizes materials instantaneously by v...
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532nm green laser is used for micro-holes and blind holes on silicon wafers
Jun 08 , 2021
532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers With a 532nm green laser, the marking of silicon wafers is clearer The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the ma...
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RFH 355nm UV laser is particularly good at wafer cutting and scribing
Jun 28 , 2021
RFH UV laser is the main light source of wafer laser scribing machine Wafer laser scribing machine manufacturers buy RFH UV lasers in bulk RFH 355nm UV laser is particularly good at wafer cutting and scribing The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the material of the quartz semiconductor for the m...
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RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers
Jun 30 , 2021
RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers RFH nanosecond UV laser makes precise wafer cutting possible Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocr...
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35W green laser is used for the processing of micro-holes and blind holes of silicon wafers
Jul 14 , 2021
35W green laser is used for the processing of micro-holes and blind holes of silicon wafers The leader in silicon wafer microvia and blind hole processing-RFH green laser On-site inspection of RFH green lasers for silicon wafer microvia and blind hole processing customers Wafers are purified by silicon elements, and pure silicon is made into growing silicon ingots, which become a quartz sem...
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355nm uv laser hollow drilling hole wallpaper
Jul 15 , 2021
355nm uv laser hollow drilling hole wallpaper With the diversification of decoration styles, wallpaper is the foundation of the entire decoration style. People are particularly concerned about the choice of wallpaper. Common wallpaper materials on the market usually include fiberglass printed wall covering, non-woven wall covering, pure cotton decorative wall covering, Chemical fiber decora...
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355nm UV laser cuts, drills, and scribes on glass wafers
Jul 19 , 2021
355nm UV laser cuts, drills, and scribes on glass wafers RFH nanosecond UV lasers are well received in wafer cutting RFH UV laser is a great technology for cutting/punching/grooving silicon wafers and silicon wafers Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials s...
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