Ultraviolet laser micro-hole processing is widely used in electronic product laser marking and laser drilling

With the advancement of science and technology and the development of industrialization, micro-holes and micro-holes are more and more widely used in the field of consumer goods, and the requirements for the processing quality of micro-holes are getting higher and higher. The traditional micro-hole processing technology can no longer meet the requirements. Among many special processing technologies, laser micro-hole processing is widely used in micro-hole processing due to its advantages of high efficiency, low cost, easy realization of multi-axis linkage control, and processing without material restrictions.

In many application fields, such as Bluetooth headsets, wristbands, phone watches and other wearable devices, the micro-holes usually required to be processed are often smooth, light-transmitting, and waterproof. However, when the existing laser marking machine is used for processing, a fiber laser with a wavelength of 1064 nm is often used for processing. Since the fiber laser is a thermal laser, on the one hand, the surface of the material will be ablated during laser processing, which cannot guarantee the quality of the processed object. The surface is smooth and cannot meet the processing requirements; on the other hand, the traditional fiber laser processing will destroy the oxide layer on the surface of the metal material, and will expose the primary color of the bottom layer of the material. The microporous perforation effect. Therefore, how to improve the light transmittance of the microhole array and reduce the damage of the oxide layer on the surface of the material is the research focus of the microhole process.

Based on this, it is necessary to provide a laser microhole processing method and equipment, which can effectively improve the light transmittance of the microhole array and reduce the degree of damage to the oxide layer on the surface of the material.

The diameter of the micropores to be processed and the marking pattern are set according to the thickness of the material to be processed, wherein the marking pattern is used to determine the distribution parameters of the micropores in the preset area; the processing parameters of the ultraviolet laser are determined, and the processing parameters Including at least one of laser frequency, laser pulse width, processing times, scanning speed, and pattern filling density; using an ultraviolet laser to process the material to be processed according to the processing parameters, the diameter of the micropore and the marking pattern Micropore processing is performed on the material to be processed, so that micropores corresponding to the diameter of the micropores are generated on the material to be processed.

The above-mentioned laser micro-hole processing method and equipment set the diameter of the micro-hole to be processed, the marking pattern and the processing parameters of the ultraviolet laser according to the thickness of the material to be processed, so that the light transmittance of the micro-hole pattern obtained after processing, and the surrounding of the micro-hole are obtained. The surface smoothness and the degree of damage of the surface oxide are controlled, thereby effectively improving the light transmittance of the micropore array and reducing the damage of the oxide layer on the surface of the material, so that the workpiece can be obtained after processing with a smooth surface, no unevenness and good light transmittance. .

The equipment is mainly used for laser marking and laser drilling of electronic products such as mobile phones, tablet computers, power adapters, electronic digital products, electronic components, and smart wearables. It is suitable for most plastic laser marking and surface marking and drilling of various alloy materials such as stainless steel, alumina and copper.