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UV laser marking plastics, white\black\graphics and texts can be marked, and the marking is clear
May 17 , 2021
UV laser marking plastics, white\black\graphics and texts can be marked, and the marking is clear Lasers are roughly classified into fiber lasers, carbon dioxide lasers, and ultraviolet lasers. Some plastics are easy to mark because they absorb laser light, while some plastics do not absorb laser light and cannot be marked with laser light at all. The absorption rate of the laser is ...
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Application of Picosecond Laser Cutting Machine in Ultra-thin Metal Foil
May 17 , 2021
Application of Picosecond Laser Cutting Machine in Ultra-thin Metal Foil In the field of ultra-thin metal materials, copper foil, stainless steel foil, titanium alloy foil, nickel alloy foil and other material processing tools, it is realized by die cutting or chemical etching. With the continuous improvement of demand, especially in 5G, Under the high standards of aerospace, satellit...
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Ultraviolet laser cutting machine is the most commonly used equipment
May 17 , 2021
Ultraviolet laser cutting machine is the most commonly used equipment in the field of micro-precision laser processing. It is mainly used for precision laser cutting, resistance adjustment, etching, scribing, drilling and other applications. It is commonly used in 3C electronics, medical, photovoltaic, automotive, aerospace And many other fields. Common cutting application materials include PCB, F...
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Application of picosecond laser cutting machine on flexible screen
May 17 , 2021
Application of picosecond laser cutting machine on flexible screen The so-called flexible screen refers to a screen that can be bent and folded freely. As a brand-new field, flexible screens are faced with many problems in the processing process, and higher requirements are put forward on the processing technology. Compared with traditional brittle material processing, OLED display screens must be...
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Why choose UV laser cutting machine for wafer cutting
May 17 , 2021
Why choose UV laser cutting machine for wafer cutting Most semiconductor materials have a good absorption of light in the ultraviolet band. Take the absorption of monocrystalline silicon in different wavelength bands as an example. When laser processing in the ultraviolet band is used to process semiconductor materials, due to the narrow focus spot of ultraviolet light, the photon energy is ...
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Picosecond laser cutting machine helps the development of thin-film solar cells
May 18 , 2021
Picosecond laser cutting machine helps the development of thin-film solar cells Among all solar thin-film battery materials, CIGS (copper indium gallium selenium) battery has the highest absorption coefficient for visible light, and the consumption of raw materials is much lower than that of traditional crystalline silicon solar cells. Compared with high-efficienc...
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Red wine glass logo laser marking should use 532nm green laser for fine engraving
May 20 , 2021
Red wine glass logo laser marking should use 532nm green laser for fine engraving Red wine glasses have become indispensable cups whether in high-end wine bureaus or family gatherings, whether they are tasting wine at home or having dinner in a hotel. Engraving or images on the red wine glass can play a role in promoting and reflecting high-end taste. The 532nm green laser developed and pro...
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Glass wine glasses customers purchase 10 RFH 532nm green lasers
May 20 , 2021
Glass wine glasses customers purchase 10 RFH 532nm green lasers Red wine glasses have become indispensable cups whether in high-end wine bureaus or family gatherings, whether they are tasting wine at home or having dinner in a hotel. Engraving or images on the red wine glass can play a role in promoting and reflecting high-end taste. The 532nm green laser developed and produced by RFH can e...
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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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355 UV laser marking plastic charging head, neat and smooth, no residue
May 22 , 2021
355 UV laser marking plastic charging head, neat and smooth, no residue Chargers are indispensable in our daily lives. They can use high-frequency power technology and can reasonably use advanced intelligent dynamic adjustment charging technology. Chargers are used in all corners of our lives. Whether it is a mobile phone, a computer or a household appliance, it needs the connection of the chargin...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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Best Laser Cutter and Engraving Machines of 2021
May 24 , 2021
uv laser | green laser | Ultraviolet lasers | uv dpss laser | nanosecond laser | UV laser source | Solid State Lasers Laser engravers are great for cutting solid and flat surfaces. Hence, many carvers use this machine to engrave their designs with finesse. One of the most popular flat surfaces for engraving is glass, of course. You...
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