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Application of Picosecond Laser Cutting Machine in Ultra-thin Metal Foil

May 17 , 2021

Application of Picosecond Laser Cutting Machine in Ultra-thin Metal Foil

   In the field of ultra-thin metal materials, copper foil, stainless steel foil, titanium alloy foil, nickel alloy foil and other material processing tools, it is realized by die cutting or chemical etching. With the continuous improvement of demand, especially in 5G, Under the high standards of aerospace, satellite and other fields, traditional craftsmanship models have gradually shown weakness. For example, die cutting will produce deformation and burr residues, which will affect product performance; chemical etching requires a screen, especially for the processing of multi-specification materials, which requires a large number of screens, which is not conducive to the processing of many types of products. In addition, chemical etching The environmental pollution is more serious, especially under the pressure of environmental protection control, more and more chemical etching processing plants are withdrawn, causing a lot of trouble to processing enterprises. Under these prerequisites, a process that uses laser cutting of ultra-thin metal foil to enter related fields has brought new ideas for the development of the industry.

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       At present, for ultra-thin metal materials, the picosecond UV laser cutting machine developed beyond laser is used in the cutting of stainless steel foil, copper foil, nickel alloy foil, titanium alloy foil and other materials. Compared with the nanosecond laser cutting equipment, the picosecond laser cutting machine has obvious advantages. It has no burrs, no deformation, low thermal influence, and the degree of carbonization is as low as 2 microns.

 

 

       The high flexibility of the picosecond laser cutting machine is not only limited to ultra-thin metal material cutting, but also for the etching of multilayer materials or the processing of micro-nano diversion structures on the surface of the material, such as silicon wafer scribing, stainless steel grating, ceramic scribing , Thin film material scribing, glass scribing, etc.

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