Microporous silicon wafer, blind hole processing,these are easy for green laser.

The process of scribing and marking a silicon wafer is complicated, but for RFH Green Laser it is a simple task. The use of green laser marking in the production of RFH can contract a series of work, as long as you debug, scribing, cutting and marking all can be solved. In addition, the accuracy and smoothness of marking and cutting can be ensured. In marking, the characters and patterns can be clearly carved on the silicon wafer and not easily blurred.

Watch manufacturer, Alexander, from Russia, recently have purchased a batch of green light lasers from RFH, which are mainly used for the drawing, cutting and punching of silicon wafers----the mirror material of watches.