Green laser solves the problem of high-precision marking of micro-holes on silicon wafers

Precision hole drilling in Silicon Wafers, pls choose RFH green laser

With a 532nm green laser, the marking of silicon wafers is clearer

The 532nm green laser produced by RFH can perform micro-hole processing on silicon wafers, and can clearly pierce micro-holes at specified positions, maintaining the efficiency and clarity of the wafer to the greatest extent, and its micro-hole arrangement It is neat and does not produce skew and difficult to use effects, which is the best way to speed up production efficiency and quality.

Yesterday, Manager Zhou (from an integrated circuit company) just ordered three 532nm solid-state green lasers for blind hole processing of silicon wafers and positioning and drilling of micro holes.