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Charging head data line laser marking customer orders again 10 sets of S9 UV lasers
Apr 22 , 2021
Charging head data line laser marking customer orders again 10 sets of S9 UV lasers Mr. Zhang, runs a processing enterprise that produces various data lines, with 10,000 square meters of workshops, equipped with advanced production equipment, and can provide one-stop solutions from data line style development, design, production and sales. Since working with RFH for more than three y...
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Ultra-fine marking on white plastic by UV laser
Apr 22 , 2021
Ultra-fine marking on white plastic by UV laser Charging head data line laser marking customer orders again 10 sets of S9 UV lasers Mr. Zhang, runs a processing enterprise that produces various data lines, with 10,000 square meters of workshops, equipped with advanced production equipment, and can provide one-stop solutions from data line style development, design, production and sales. &nb...
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S9 UV laser engraves on black plastic plastic at high speed, clear and undistorted
Apr 22 , 2021
S9 UV laser engraves on black plastic plastic at high speed, clear and undistorted Mr. Zhang, runs a processing enterprise that produces various data lines, with 10,000 square meters of workshops, equipped with advanced production equipment, and can provide one-stop solutions from data line style development, design, production and sales. Since working with RFH for more than three ye...
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tempered glass be cut or drilled by 532nm green laser
Apr 21 , 2021
tempered glass be cut or drilled by 532nm green laser
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532 Green laser cut tempered glass
Apr 20 , 2021
532 Green laser cut tempered glass
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
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