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Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed
Jun 01 , 2021
Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photo...
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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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UV laser cutting machine for cutting and scribing solar panels
Jun 02 , 2021
UV laser cutting machine for cutting and scribing solar panels As the global shortage of primary energy becomes more and more severe, the development and utilization of clean energy has become an urgent problem to be solved in various industries around the world. Solar cell is a device that can convert light energy into electrical energy, mainly silicon-based sola...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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15W UV laser is specially used for FPC flexible circuit board cutting and scribing
Jun 04 , 2021
15W UV laser is specially used for FPC flexible circuit board cutting and scribing Ultraviolet laser 355nm narrow wavelength can realize FPC circuit board fine marking High-power UV laser for cutting and scribing FPC flexible circuit boards can avoid burrs FPC soft board is a kind of flexible circuit board with the simplest structure, mainly used for connection with other circuit boards. In...
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Industrial application of infrared picosecond laser cutting machine
Jun 04 , 2021
Industrial application of infrared picosecond laser cutting machine At present, the manufacturing industry has entered the "light" era. From nanoseconds, picoseconds, and femtoseconds, people's exploration of laser technology has never stopped. Ultrafast laser refers to a laser whose pulse time width is on the order of femtoseconds or picoseconds. It vaporizes materials instantaneously by v...
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532nm green laser is used for micro-holes and blind holes on silicon wafers
Jun 08 , 2021
532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers With a 532nm green laser, the marking of silicon wafers is clearer The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the ma...
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RFH 355nm UV laser is particularly good at wafer cutting and scribing
Jun 28 , 2021
RFH UV laser is the main light source of wafer laser scribing machine Wafer laser scribing machine manufacturers buy RFH UV lasers in bulk RFH 355nm UV laser is particularly good at wafer cutting and scribing The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the material of the quartz semiconductor for the m...
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RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers
Jun 30 , 2021
RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers RFH nanosecond UV laser makes precise wafer cutting possible Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocr...
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15W high-power UV laser for drilling, scribing and cutting
Jul 09 , 2021
15W high-power UV laser for drilling, scribing and cutting 15W nanosecond solid-state UV laser, a dark horse in marking The Expert III 355 series UV diode-pumped pulsed solid-state laser developed and produced by Shenzhen RFH Laser Technology Co., Ltd. has a power range of 10W-15W. It adopts a unique laser cavity design, acousto-optic Q-switching technology, and high-precision cooling syste...
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35W green laser is used for the processing of micro-holes and blind holes of silicon wafers
Jul 14 , 2021
35W green laser is used for the processing of micro-holes and blind holes of silicon wafers The leader in silicon wafer microvia and blind hole processing-RFH green laser On-site inspection of RFH green lasers for silicon wafer microvia and blind hole processing customers Wafers are purified by silicon elements, and pure silicon is made into growing silicon ingots, which become a quartz sem...
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3W5W nanosecond UV laser cutting, marking, scribing and punching technology
Jul 16 , 2021
3W5W nanosecond UV laser cutting, marking, scribing and punching technology Marking box with S9 UV laser without fear of being scorched RFH UV laser easily controls LOGO, text, barcode, and QR code marking A complete product may not be displayed in front of your eyes at the first glance, it may not be its parameter specifications, may not be the internal structure, may not be the main funct...
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