How laser uv 355 nm cutting achieves high-quality flexible circuit boards

For FPC, the polyimide protective film functions the same as the solder mask for FR4-based printed circuit boards (PCBs). Polyimide is typically 12-25µm thick, coated with a pressure-sensitive adhesive, and attached to a paper-based material. The key challenge is to ablate patterns at high speed in polyimide while avoiding thermal effects such as adhesive melting and paper base burning/charring. The current protective film patterning process combines a pulsed nanosecond UV laser with a two-dimensional galvanometer to achieve high-speed processing with very low thermal effects. However, in some applications where quality is critical, UV picosecond pulse widths are more favorable.

Using picosecond UV lasers produces less debris than nanosecond UV lasers, while being able to process at higher pulse frequencies (and thus higher speeds) without causing inconsistencies in the adhesive and paper base layers necessary thermal effect.

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Choose ultrafast laser UV picosecond laser cutting machine, which can be used to process various FPC materials. Materials processed include polyimide based protective films (25µm thick polyimide + adhesive layer on paper base), copper/liquid crystal polymer/copper (Cu/LCP/Cu) laminates, and exposed liquid crystal polymer material (LCP) material. LCPs are important dielectric materials used in high-speed radio frequency (RF) data transmission technologies.

In many cases, shorter ultraviolet (UV) wavelengths offer additional benefits. Shorter wavelengths allow for smaller focused spots and longer depths of field. In addition, ultraviolet wavelengths can couple laser energy into a wider variety of materials than infrared wavelengths. One of the industries that combines many different materials is flexible printed circuit (FPC) manufacturing. Therefore, UV picosecond laser cutting machine is undoubtedly a better solution to realize high-quality flexible circuit board processing. As a result, the quality and output of laser processing can be greatly improved.