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Hole Drilling by Laser
May 06 , 2021
Hole Drilling by Laser This section introduces laser processing-based drilling through examples. Basic principles of drilling using laser markers Hole drilling example — Drilling holes in rice bags Recommended models for hole drilling, organised by material Basic principles of drilling using laser markers Laser-based drilling uses laser light to irradiate a single point of a target in...
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Why choose UV laser cutting machine for wafer cutting
May 17 , 2021
Why choose UV laser cutting machine for wafer cutting Most semiconductor materials have a good absorption of light in the ultraviolet band. Take the absorption of monocrystalline silicon in different wavelength bands as an example. When laser processing in the ultraviolet band is used to process semiconductor materials, due to the narrow focus spot of ultraviolet light, the photon energy is ...
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How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed
Jun 01 , 2021
Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photo...
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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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Laser cutting and drilling are widely used in the medical industry
Jun 03 , 2021
Laser cutting and drilling are widely used in the medical industry The laser cutting process is very suitable for cutting blades, precision shafts, brackets, sleeves, and hypodermic needles. Laser cutting generally uses nanosecond, picosecond or femtosecond pulsed lasers to directly ablate the surface of the material without any post-processing procedures. , Its heat-affected z...
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Industrial application of infrared picosecond laser cutting machine
Jun 04 , 2021
Industrial application of infrared picosecond laser cutting machine At present, the manufacturing industry has entered the "light" era. From nanoseconds, picoseconds, and femtoseconds, people's exploration of laser technology has never stopped. Ultrafast laser refers to a laser whose pulse time width is on the order of femtoseconds or picoseconds. It vaporizes materials instantaneously by v...
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The partner of PCB circuit board marking, cutting and drilling-S9 UV laser
Jun 07 , 2021
Although the size of UV laser S9 is small, it can realize PCB marking with high precision The sharp edge of PCB circuit board marking QR code-S9 UV laser The partner of PCB circuit board marking, cutting and drilling-S9 UV laser PCB circuit board, also called printed circuit board, is an important electronic component, a support for electronic components, and a carrier for electrical connec...
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532nm green laser is used for micro-holes and blind holes on silicon wafers
Jun 08 , 2021
532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers With a 532nm green laser, the marking of silicon wafers is clearer The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the ma...
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