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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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Industrial application of infrared picosecond laser cutting machine
Jun 04 , 2021
Industrial application of infrared picosecond laser cutting machine At present, the manufacturing industry has entered the "light" era. From nanoseconds, picoseconds, and femtoseconds, people's exploration of laser technology has never stopped. Ultrafast laser refers to a laser whose pulse time width is on the order of femtoseconds or picoseconds. It vaporizes materials instantaneously by v...
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532nm green laser is used for micro-holes and blind holes on silicon wafers
Jun 08 , 2021
532nm green laser is used for the processing of micro-holes and blind holes on silicon wafers Green laser solves the problem of high-precision marking of micro-holes and blind holes on silicon wafers With a 532nm green laser, the marking of silicon wafers is clearer The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the ma...
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RFH 355nm UV laser is particularly good at wafer cutting and scribing
Jun 28 , 2021
RFH UV laser is the main light source of wafer laser scribing machine Wafer laser scribing machine manufacturers buy RFH UV lasers in bulk RFH 355nm UV laser is particularly good at wafer cutting and scribing The wafer is purified by silicon element (99.999%), and then the pure silicon is made into a long silicon ingot, which becomes the material of the quartz semiconductor for the m...
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RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers
Jun 30 , 2021
RFH UV laser has become an excellent auxiliary tool for blind hole and micro-hole drilling on wafers RFH nanosecond UV laser makes precise wafer cutting possible Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocr...
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355nm UV laser marking and dicing on flexible FPC boards realizes perfect
Jul 14 , 2021
355nm UV laser marking and dicing on flexible FPC boards realizes perfect FPC flexible panel customers appreciate the RFH 355nm ultraviolet laser RFH 335nm ultraviolet laser has a perfect answer for cutting FPC flexible panels RFH, which advocates craftsmanship and professionalism, will always show 100% enthusiasm when facing customers, and will be 100% attentive to customers' usage a...
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35W green laser is used for the processing of micro-holes and blind holes of silicon wafers
Jul 14 , 2021
35W green laser is used for the processing of micro-holes and blind holes of silicon wafers The leader in silicon wafer microvia and blind hole processing-RFH green laser On-site inspection of RFH green lasers for silicon wafer microvia and blind hole processing customers Wafers are purified by silicon elements, and pure silicon is made into growing silicon ingots, which become a quartz sem...
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355nm UV laser cuts, drills, and scribes on glass wafers
Jul 19 , 2021
355nm UV laser cuts, drills, and scribes on glass wafers RFH nanosecond UV lasers are well received in wafer cutting RFH UV laser is a great technology for cutting/punching/grooving silicon wafers and silicon wafers Wafer is the basic material used to manufacture IC. The silicon element is purified and made into long silicon ingots. When making integrated circuits, semiconductor materials s...
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uv laser factories for wafer serialization, marking and scribing
Nov 15 , 2021
uv laser factories for wafer serialization, marking and scribing customer reviews This is a useful uv laser. I am QUITE happy with it. It was easy to assemble using videos readily available on YouTube and the included instruction "Manual". For my first laser, it is a lot of fun. There is definitely a learning curve, but after putting in the time, I have made some awesome laser ...
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wafer uv laser source marking and wire stripping
Nov 18 , 2021
wafer uv laser source marking and wire stripping customer reviews Nice laser machine, goes together easily. Don't have to assemble, everything works well, and seems nice and tight. The included windows program works fine on Windows 7, I may switch to some other Mac or Raspberry Pi based program but this was an easy way to get started. uv laser | green laser&nbs...
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3W 5W laser marking silicon with water-cooling
Nov 23 , 2021
3W 5W laser marking silicon with water-cooling customer reviews Highly recommend. Professional uv laser cutting machine manufacturer. RFH could offer a solution immediately when I had problems. A buy without regretted. uv laser | green laser | Ultraviolet lasers | uv dpss laser | nanosecond laser | UV laser source | So...
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