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Ultraviolet laser cutting machine is the most commonly used equipment
May 17 , 2021
Ultraviolet laser cutting machine is the most commonly used equipment in the field of micro-precision laser processing. It is mainly used for precision laser cutting, resistance adjustment, etching, scribing, drilling and other applications. It is commonly used in 3C electronics, medical, photovoltaic, automotive, aerospace And many other fields. Common cutting application materials include PCB, F...
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Application of picosecond laser cutting machine on flexible screen
May 17 , 2021
Application of picosecond laser cutting machine on flexible screen The so-called flexible screen refers to a screen that can be bent and folded freely. As a brand-new field, flexible screens are faced with many problems in the processing process, and higher requirements are put forward on the processing technology. Compared with traditional brittle material processing, OLED display screens must be...
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Why choose UV laser cutting machine for wafer cutting
May 17 , 2021
Why choose UV laser cutting machine for wafer cutting Most semiconductor materials have a good absorption of light in the ultraviolet band. Take the absorption of monocrystalline silicon in different wavelength bands as an example. When laser processing in the ultraviolet band is used to process semiconductor materials, due to the narrow focus spot of ultraviolet light, the photon energy is ...
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Advantages of Picosecond Laser Cutting FPC Copper Clad Laminate
May 18 , 2021
Advantages of Picosecond Laser Cutting FPC Copper Clad Laminate Due to its short pulse width and high peak power characteristics, picosecond lasers have minimal thermal impact during processing, and are therefore widely used in the field of micro-nano processing. With the development of electronic products in the direction of miniaturization and lightweight, the market has further increased the re...
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Picosecond laser cutting machine helps the development of thin-film solar cells
May 18 , 2021
Picosecond laser cutting machine helps the development of thin-film solar cells Among all solar thin-film battery materials, CIGS (copper indium gallium selenium) battery has the highest absorption coefficient for visible light, and the consumption of raw materials is much lower than that of traditional crystalline silicon solar cells. Compared with high-efficienc...
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Why do thin-film solar cells need to be cut with a UV laser?
May 18 , 2021
Why do thin-film solar cells need to be cut with a UV laser? Solar energy is one of the main clean and renewable new energy sources to replace fossil energy in the future. As a relatively mature solar cell currently very promising, thin-film solar cells have the advantages of saving raw materials, low cost, good weak light absorption, and being able to produce large-are...
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Picosecond laser etching of PI film solar cells
May 20 , 2021
Picosecond laser etching of PI film solar cells Solar thin film batteries can be divided into two categories: hard substrates and flexible substrates. Flexible thin-film solar cells refer to thin-film solar cells made on flexible materials (such as stainless steel, polyimide, etc.). Compared with thin-film solar cells on hard substrates (such as glass), flexible t...
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Advantages of laser cutting solar PI film screen
May 20 , 2021
Advantages of laser cutting solar PI film screen At present, the mainstream solar screen processing is to use the exposure method to make electrode patterns on photosensitive materials; laser cutting is a revolutionary screen processing technology that contributes to the industry's cost reduction and efficiency enhancement. Compar...
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Advantages of UV laser cutting PI film
May 20 , 2021
Advantages of UV laser cutting PI film With the development of laser technology, the use of UV laser cutting PI cover film gradually replaces the traditional die cutting. Ultraviolet laser cutting is a non-contact processing, no expensive molds are needed, and the production cost is greatly reduced. The focused spot can be only a dozen micrometers, which can meet...
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How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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Laser cutting is the future development direction of lithium battery processing
May 21 , 2021
Laser cutting is the future development direction of lithium battery processing Laser cutting technology is the future development direction of lithium battery processing. Laser cutting technology has the characteristics of controllable processing, high efficiency, and high quality. It has a very broad application in the industrial processing of lithium batteries. Laser...
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