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Ultraviolet laser cutting solar screen film to extend service life
Jun 01 , 2021
Ultraviolet laser cutting solar screen film to extend service life According to the cell cost composition data of the China Photovoltaic Industry Association: silicon cost accounted for 65%, non-silicon cost accounted for 35%, and the metalization process accounted for more than 20% of the battery cost, so research and development promote the progress of metalization New technologies are crucial t...
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Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed
Jun 01 , 2021
Ultraviolet laser cutting solar cell silicon wafers has high repeatability, stable work and fast speed As the "main force" of the global new energy development, the photovoltaic industry has been highly sought after by the market since its inception. In recent years, with the promotion of policies and the continuous cost reduction and efficiency enhancement of photovoltaic enterprises, photo...
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Laser cutting and scribing processing of sapphire wafers
Jun 01 , 2021
Laser cutting and scribing processing of sapphire wafers As we all know, the LED chip as the core component of the LED lamp is a solid-state semiconductor device. The heart of the LED is a semiconductor chip. One end of the chip is attached to a bracket, one end is the negative pole, and the other end is connected to the positive pole of the power supply. The chip is encapsulated by epoxy re...
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UV laser cutting machine for cutting and scribing solar panels
Jun 02 , 2021
UV laser cutting machine for cutting and scribing solar panels As the global shortage of primary energy becomes more and more severe, the development and utilization of clean energy has become an urgent problem to be solved in various industries around the world. Solar cell is a device that can convert light energy into electrical energy, mainly silicon-based sola...
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Picosecond laser marking machine for fine marking and cutting of mobile phone circuit boards
Jun 02 , 2021
Picosecond laser marking machine for fine marking and cutting of mobile phone circuit boards In the manufacturing process of various components of smartphones, laser processing technology can be seen everywhere, such as mobile phone shell cutting, marking, welding, motherboard manufacturing, keyboard chip marking and engraving and punching of earpieces, earphones, accessories, and so...
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How to solve the problem of laser cutting machine cutting circuit board
Jun 02 , 2021
How to solve the problem of laser cutting machine cutting circuit board The laser cutting machine can cut all kinds of materials by emitting energy. But long-term use of the cutting machine will cause malfunctions and problems to a certain extent. There are many reasons for this problem, including parameters, lenses, optical path and power, etc. Here is how to solve this proble...
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UV laser cutting camera module, no burrs
Jun 02 , 2021
UV laser cutting camera module, no burrs The outbreak of the mobile phone camera module industry has created huge development space for small and medium-sized enterprises. In order to ensure the photographic effect of the camera, each camera product must maintain a high degree of consistency. In addition, special cutting fixtures are needed when cutting the bracket, and high-definition CCD ...
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Why picosecond laser cutting machine is the best choice for flexible circuit board cutting
Jun 02 , 2021
Why picosecond laser cutting machine is the best choice for flexible circuit board cutting Compared with the nanosecond laser cutting machine, the picosecond laser cutting machine has shorter pulse width and higher peak power, and the laser acts on the surface of the material for a shorter time, which can achieve better and finer processing effects and realize tr...
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532 green laser scribing, cutting and marking solutions on silicon wafers
Jun 03 , 2021
532 green laser scribing, cutting and marking solutions on silicon wafers 532nm green laser can avoid bursting when drilling silicon wafers Silicon wafer micro-holes, blind hole processing, green lasers are all handy Silicon wafers are purified from silicon and made into long silicon ingots, which become the material of quartz semiconductors for manufacturing integrated circuits. After phot...
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Fiber composite material cut by UV laser
Jun 03 , 2021
Fiber composite material cut by UV laser Carbon fiber, because of its high strength, high modulus, low density, resistance to rapid cold, rapid heat, acid resistance, oil resistance, corrosion resistance, etc., is known as the "crown jewel" in the field of new materials. It is used in aerospace and rail transportation. Indispensable key materials in many high-end ...
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Application of laser cutting in lamps and lanterns
Jun 03 , 2021
Application of laser cutting in lamps and lanterns Laser cutting machine is now the mainstream tool for metal processing, and laser cutting has also become an important means of personalized metal lighting production. In response to the individual needs of customers, the lighting designer designs the lighting, draws the ideal model on the manuscript paper, and then writes it into the ...
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Laser cutting and drilling are widely used in the medical industry
Jun 03 , 2021
Laser cutting and drilling are widely used in the medical industry The laser cutting process is very suitable for cutting blades, precision shafts, brackets, sleeves, and hypodermic needles. Laser cutting generally uses nanosecond, picosecond or femtosecond pulsed lasers to directly ablate the surface of the material without any post-processing procedures. , Its heat-affected z...
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