Bare wafer laser scribing with 355nm ultraviolet laser
355nm ultraviolet can also be used to scribe silicon wafer. Scribing causes partial cut lines on the wafer. This lines introduces regions of weakness. This is usually by a mechanical breaking procedure to produce silicon rectangular tiles for subsequent operations.he mechanical break will follow allowing the scribing line offering the least path of resistance. The laser is a high throughput, cost effective and simple way to effect the scribing with accuracy and long term reliability.
S9-Y series solid state pulsed UV laser is ultra compact. The whole part of power supply is integrated into the laser head. This makes the size of the laser more smaller, and the integration into a system more easier and convenient. S9-Y series is of short pulse width(<12ns@30k)，superior beam quality(M²<1.2) and perfect laser sport quality(beam circularity>90%).
355nm ultraviolet laser: https://www.rfhtech.com/s9-y-series-integrated-3w-10w-uv-laser_p10.html
