Laser Etching and Engraving Glass with diode-pumped water cooled UV laser 

  Korea 3d crystal laser subsurface inner engraving machine facotry choose RFH Water cooled uv laser  Expert II 355 series UV DPSS laser, developed and produced by RFH, covers 3w-10w in laser power with short pulse width (<14ns@30K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is specifically designed for SLA 3D printer, laser marking machine, high precision cutting machine, high precision drilling machine, laser wire stripping machine, Er:YAG laser cosmetic instrument, glass inner engraving machine and so on.

5 watt water cooled uv laser source mark white on alumina To meet the market demand, RFH newly developed S9 series UV laser . Comparing with its kinds, S9 series UV laser features with rugged sealed cavity, extremely compact size, simple and robust, high stability, high efficiency, high reliability and excellent laser beam quality.Its compact design suggests no necessity in building big light path, which greatly reduces space and cost and makes it easy to be installed into UV laser marking machines. In addition, S9 series cavity structure is more stability and more excellent scalability, which means the same laser cavity can be produces multi-power lasers , and the stability of different power ranges is greatly improved

RFH UV lasers provide a light source for 3D printing and have played an important role in the development of 3D printing. Ultraviolet laser has the advantages of good monochromaticity, directivity, strong coherence and high power density.

In the realm of semiconductor manufacturing, intricacies abound, with the drilling of silicon wafers taking center stage. As technology advances, the demand for more precise and efficient drilling methods escalates, leading to the emergence of a transformative solution: the water-cooled UV laser source. This cutting-edge technology has revolutionized the industry, offering unparalleled power, accuracy, and reliability, elevating the art of silicon wafer drilling to new heights.