RFH 10w high-power ultraviolet laser is produced by ultra-short pulse ultraviolet technology through non-contact laser emission. The ultraviolet light emitted by it can cut the wafer with high precision without subsequent auxiliary treatment Reduced to about 0.02mm. Compared with the traditional cutting technology, RFH high-power ultraviolet laser can cut the wafer into the desired shape without adding blades or replacing consumables, and the production method that can be operated only by plugging in and installing is also greatly reduced. Cost of production.