UV Laser 355nm,green Laser 532nm,nanosecond Lasers,solid State Lasers -RFH Laser

532nm green laser spot is suitable for scribing and etching thin film optoelectronic devices
532nm green laser spot is suitable for scribing and etching thin film optoelectronic devices Thin-film optoelectronic devices are an inaccessible part of LCD panels. They are generally made of materials such as PET and PVC. They are made of materials with insulating effects and antistatic effects. And such a material, because of its lightness and thinness, requires very good technology to be able to cut.

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Singapore customers purchase RFH UV nanosecond laser marking bulbs for traceability and anti-counterfeiting
Singapore customers purchase RFH UV nanosecond laser marking bulbs for traceability and anti-counterfeiting Ultraviolet laser is a non-contact marking technology. Compared with the past technology, it has a great improvement. It completely avoids the defects of the past technology in principle and use, and reaches a very good level.

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Nanosecond UV laser marking on the plastic surface of HUAWEI P50 Pro mobile phone charger
Nanosecond UV laser marking on the plastic surface of HUAWEI P50 Pro mobile phone charger A few days ago, Huawei Ren Zhengfei's daughter Meng Wanzhou finally returned to China. On the day of her return, all the people celebrated the news. The performance and quality of Huawei's mobile phones have once again attracted attention.

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35W green laser Cold source cutting PCB circuit board at high speed, smooth and not deformed
35W green laser Cold source cutting PCB circuit board at high speed, smooth and not deformed PCB circuit boards are currently used in many electronic devices, whether it is the earliest red and white phones or today's Switches, smart phones, cameras, etc., they all play an important role in the architecture of the electronic circuits. The mass production of circuit boards requires full-page cutting of more entire circuit boards. In order not to damage the material, fine but high-speed cutting is required.

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For wafer scribing and dicing, you need the sharp edge of the RFH UV laser
For wafer scribing and dicing, you need the sharp edge of the RFH UV laser Wafer is the basic material used to manufacture IC. It is made into long silicon ingots after purification of silicon elements. When making integrated circuits, semiconductor materials should be used to melt polysilicon out of monocrystalline silicon ingots through multiple procedures, and then cut to produce Made. As an electronic component, it is used in many electronic products. The wafer area is usually small, so there is a high precision requirement in cutting and scribing.

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Laboratory application! 15W20W high power UV laser light curing SLA model
Laboratory application! 15W20W high power UV laser light curing SLA model The light-curing SLA model is an important module in 3D printing technology. It can directly make a CAD digital model into a prototype, with fast processing speed and short product production cycle. But after the light-curing SLA model is shaped, it needs to be light-cured plasticity. At this time, most manufacturers will choose more advanced and prominent UV technology.

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RFH 3W10W UV laser engraves transparent plastic inside to solve the problem of surface explosion
RFH 3W10W UV laser engraves transparent plastic inside to solve the problem of surface explosion When it comes to internal carving, many people will definitely think of materials like glass and crystal. It must be admitted that the most common in-carving craftsmanship in real life is made of materials such as glass or crystal, and most of them are made into beautiful crafts.

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S9 UV laser marks crystal complex patterns and characters, with smooth edges and no burrs
S9 UV laser marks crystal complex patterns and characters, with smooth edges and no burrs Everyone likes crystals that are crystal clear, and there are many objects in life that need to use crystal material, but the hardness of the crystal is 7 and it is relatively brittle. If you don't pay attention to it, you may damage the entire material when carving.

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