RFH 10 watt solid-state 355 nm ultraviolet laser cutting wafer Expert III 355 series UV DPSS laser, developed and produced by RFH, covers 10w-15w in laser power with short pulse width (<20ns@40K) ,superior beam quality (M²<1.2) and perfect laser spot quality (beam circularity >90%). It is widely used in PE/PCB/FPC cutting, glass & sapphire cutting, drilling, scribing & cutting used in high precision micromaching areas.

UV laser cutting is to use UV laser beam to conduct non Thermochemistry reaction on silicon ingot, so that it can be directly gasified or evaporated, thus achieving efficient, accurate and burr free cutting. UV laser cutting has the following advantages: