High-power UV lasers meet growing demand for precise, chip-free cutting of thin glass
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Glass is almost everywhere and has been around for over 5,000 years. Therefore, it is easy to overlook the fact that it is a unique material with a very useful combination of physical properties. The most obvious of these, and the most valuable, is that it is transparent.
However, glass also has mechanical strength and relatively scratch resistance. Plus, it won't react with most chemicals -- even many strong acids. Also, neither liquid nor gas can pass through it. Glass is even biocompatible, meaning that sterilized glass can be safely implanted in the human body.
RFH 10w20w UV Laser for Mobile Phone Glass Display Button Cutting
For these reasons, and more, the use of glass has expanded far beyond the architectural and automotive windows we are all familiar with, to increasingly complex products. It has been widely used in medical devices, life science instruments, semiconductor tools and consumer electronics. In the latter, it is used in the displays of mobile phones, laptops, tablets and TVs.
The old way can't cut it
In many of these high-tech applications, there is a constant push for products to become more complex, yet smaller and lighter. In the case of glass, this often means thinner parts, often with curved edges or cutouts. An example of this could be a phone display with a cutout for the Home button.
Nanosecond UV laser for efficient marking and cutting glass
However, this demand presents challenges. This is because traditional glass cutting methods—such as good old-fashioned mechanical cutting with carbide tools or water jet cutting—cannot easily machine very thin sheets of glass, or create these features—especially tight curves. At least not within the required cost and production time constraints. Even the usual laser glass cutting methods cannot cut at cost-effective marketing speeds.
Additionally, these older glass cutting methods create very small cracks and residual stresses in the glass. This makes the glass more prone to breakage during subsequent handling and use. Because, oddly enough, it turns out that when glass breaks, the crack almost always starts at the outer edge, even when force is applied in the center.
RFH High Power UV Laser Expert III 355 Accelerates Precision Laser Glass Cutting
Most glass cutting processes also typically produce small chips and chips, as well as cutting edges that are not necessarily perfectly perpendicular to the glass surface. Due to all this, various additional steps may be required, such as grinding or polishing the cut surface.
For manufacturers, any additional processing steps required after cutting mean increased production time and costs. Additionally, they can have a negative impact on the environment if they create difficult-to-handle debris or require large amounts of water to clean.
A new cutting method called "filamentation" was developed specifically to meet the growing demand for precise, stress-free, chip-free, free-form cutting of thin glass. Filamentation requires ultrashort-pulsed UV lasers because only these UV lasers can generate the very high peak powers that the technology relies on.
Winner in Precision Glass Manufacturing - RFH High Power UV Laser Expert III 355
During filament formation, the RFH high-power UV laser Expert III 355 is focused into the glass, creating a row of microscopic voids (or filaments) that can penetrate several millimeters. To make a continuous cut, the laser beam is moved relative to the glass in the desired pattern and produces a series of very closely spaced filaments. Depending on the thickness and type of glass, the parts can be separated directly along the cut or by heating.
RFH High Power UV Laser
Filament can cut curves and inserts (without taper) into glass thicknesses from 0.05mm to 10mm at high speed. and,
The use of glass in high-tech products will obviously continue because nothing else can match it. Furthermore, the RFH high power UV laser Expert III 355 cutting is capable of producing glass components with the level of precision required for these demanding new applications.
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