What products can precision picosecond UV laser cutting be used for?

Picosecond UV laser cutting machine is an important tool in the field of micro-precision machining. It has a wide range of applications in aerospace, automobile manufacturing, mobile phone manufacturing, and micro-precision instruments. It has extraordinary performance and represents the representative of advanced technology. A high-precision, high-precision knife.

With the continuous development of laser technology, picosecond UV laser cutting machines play an important role in China's vast consumer market. With the continuous development of laser technology, picosecond UV laser cutting machine has been supported by hard technology and extended to a wider manufacturing market.

Application of picosecond laser cutting circuit board:

PCB is an important carrier of electronic components and is widely used. With the upgrading of smart products, the processing requirements for PCB sub-boards are getting higher and higher, and laser cutting technology is gradually introduced into the PCB industry. The picosecond UV laser cutting machine is mainly used for PCB laser cutting in the PCB industry, such as FR4, reinforced steel sheet, FPC, rigid-flex board, fiber-optic board, etc.

Application of laser cutting picosecond UV film material:

The prepared film materials include PET films, PI films and films of other transparent materials. The picosecond UV laser cutting machine can directly cut film materials. The typical application is UV laser cutting of PET film; it can also etch some conductive metal film materials, including constantan, copper, aluminum, ITO, silver paste, FTO and other film materials. , etching and resistance adjustment; glass, white goods and other materials are attached with PI film cutting, which does not damage the substrate.

Application of picosecond UV laser cutting metal and glass materials:

Thin metal refers to metal materials not exceeding 0.2 mm, such as copper foil, aluminum foil, stainless steel, alloy materials, etc. , and the glass material is mainly 3C thin glass, all of which are processed by picosecond ultraviolet laser cutting machine, without burrs, low carbonization, and no deformation, achieving precision cutting, used in military components, photovoltaic copper foil and other industries.

Silicon, ceramic materials, picosecond UV laser cutting applications:

Silicon wafer is the basic material of important electronic components, and its application range is self-evident. There are many application processes for silicon wafer ceramic laser cutting. This article describes the application of UV laser cutting of silicon wafers and soft ceramics.

Picosecond UV laser cutting machines are widely used, and there are more fields in the market that require scientific research and development. At present, it is necessary to continuously improve picosecond UV laser technology to contribute to China's manufacturing industry.