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What is the difference between green, infrared and ultraviolet laser cutting?

Jun 04 , 2021

What is the difference between green, infrared and ultraviolet laser cutting?

 

         The laser cutting machine is an important tool in the cutting field and is known as the fast "knife". The principle is to irradiate the surface of the material with a high-density and high-energy laser beam to vaporize and remove part of the material to form a cut. At present, there are many kinds of lasers in the laser application on the market, which are divided into many kinds of light sources. Each light source has different advantages and is applied to various materials;

 

         Several light sources commonly used in laser cutting in the circuit board industry, optical fiber (red light), purple light (ultraviolet), green light, different light sources are used in different materials, according to the characteristics of the processed materials, the thickness of the materials, and the processing The higher the quality requirements and the higher the requirements for the quality of the laser beam and the thermal impact, the different absorption of the laser waveband, and the selected laser cutting machine will also be different;

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Optical fiber (red light):

 

    The wavelength of the optical fiber is 1064nm, which has high stability, high precision, fast running speed, low processing cost, high laser power, and various types of cutting materials, which is suitable for processing large products;

 

Applicable optical fiber materials: stainless steel plate, aluminum substrate, ceramic substrate, copper substrate, PCB, ceramic sheet, carbon steel, aluminum alloy, brass, copper, pickling plate, galvanized plate, silicon steel plate, electrolytic plate, titanium alloy, manganese Alloys, etc., suitable for cutting various metal materials;

 

 

Green light:

 

    The wavelength of green light is 532nm. It has a small spot and a shorter focal length. It belongs to the cold working mode and plays an irreplaceable role in precision cutting, especially in industries such as circuit boards, glass, ceramics, jewelry, and glasses. Their figure.

 

Green light applicable materials: precision cutting of covering film, FPC soft board, PCB soft and hard board, PET/PI/PP and other flexible films, ultra-thin glass, ceramic substrate and other materials;

 

 

Ultraviolet (purple light):

 

    The ultraviolet laser has a wavelength of 355nm. The product of this wavelength is an all-rounder, and its spot is also very small. Due to the special UM wavelength, it has this all-round title in the traditional processing field. Laser marking, laser cutting, and laser welding can all be seen His figure, fiber laser can not sit, it can be done, it can also be processed by C02, it performs well in ultra-wave cutting, for the fine and ultra-thin cutting of metal products, it can be burr-free, neat and smooth , Fast speed, low energy consumption and other advantages.

 

    Ziguang applicable materials: cover film, FPC soft board, PCB soft and hard board, FPC auxiliary materials, ultra-thin metal, ceramics, polymer materials, resin, silicon wafer, PET/PI/PP film, adhesive film, copper foil, explosion-proof film , Electromagnetic film, Sony glue and other flexible films;

 

 

    Fiber lasers are rarely used in the circuit board industry, mainly in the metal industry, and a small part are used in aluminum substrates and copper substrates. At present, the circuit board industry is basically UV and green light cutting machines, since they are all circuit board cutting Application, what is the specific difference?

 

    The main difference between UV laser cutting machine and green laser cutting machine lies in the cost of equipment, processing efficiency, processing effect and processing purpose. In the PCB field, the UV laser cutting machine can take into account the FPC soft board cutting, IC chip cutting and some ultra-thin metal cutting, while the high-power green laser cutting machine can only cut the PCB hard board in the PCB field. Although cutting can also be done on boards and IC chips, the cutting effect is lower than that of UV lasers. Compared with the UV laser cutting machine, the price of the green laser cutting machine is lower, and the early processing efficiency is higher. However, as the power of the UV laser cutting machine continues to rise, this advantage is gradually being equalized. The heat influence on the processing effect is smaller and the effect is more ideal.

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