What are the scope of application of High-power and UV Lasers?

Almost all plastic types can be engraved with UV UV laser technology, including polyethylene (PE), polyvinyl chloride (PVC), polypropylene (PP), polystyrene (PS), polylactic acid (PLA), polycarbonate (PC), acrylic (PMMA), acetal (polyoxymethylene, POM), nylon (PA), ABS (acrylonitrile butadiene styrene) and other materials.

UV laser markers can also engrave and mark metals, but not always with the same results as fiber laser markers. Fiber lasers can etch deep and sharp effects on metal surfaces, while UV lasers have problems etching metals covered with paint or highly reflective metals like copper. Metal materials that can be engraved by UV UV laser technology include aluminum, gold, platinum, silver, titanium, brass, stainless steel, etc.

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The UV UV laser marking machine can also engrave and engrave wood materials such as mahogany, walnut, oak, birch, maple, cherry, pine, spruce, cedar, fir, larch, MDF, plywood and fiberboard. mark. In addition, it can process garments rich in synthetic fibers, including glass and cardboard.

Ultraviolet UV laser is a very different technology from carbon dioxide and fiber laser technology, also known as blue laser beam, this technology has the ability to engrave with low calorific value. The light wave or ultraviolet spectrum of UV laser marking machine is one of the main reasons why this technology can mark on different materials, because it does not heat the surface of the material like fiber and carbon dioxide laser marking machines, it belongs to cold light engraving.

UV laser marking machine can clearly mark all plastics and other materials that have adverse reactions to heat, and is especially suitable for marking food, pharmaceutical packaging materials, drilling micro-holes, high-speed division of glass materials and complex processing of silicon wafers. Graphic cutting and other application fields.

The scope of application of UV UV laser marking machine includes: flexible pcb board marking and scribing; silicon wafer micro-hole and blind-hole processing; LCD liquid crystal glass two-dimensional code marking, glassware surface drilling, metal surface coating marking ;Marking on plastic buttons, electronic components, gifts, communication equipment, building materials and other materials.