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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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tempered glass be cut or drilled by 532nm green laser
Apr 21 , 2021
tempered glass be cut or drilled by 532nm green laser
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High-speed, reliable laser systems for pharmaceutical tablet drilling
Apr 26 , 2021
Laser drilling is a proven, economically viable way to create sub-millimeter apertures in pharmaceutical tablets. These apertures play an important role in modern drug delivery systems, which provide many health benefits like decreasing dosing frequencies, achieving consistent drug concentrations in the blood and enabling customized delivery profiles. Osmotic drug delivery systems are especially v...
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FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology
Apr 27 , 2021
FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology Our common mobile phones, TVs, computers, kitchen induction cookers, rice cookers, range hoods, chargers, remote controls and other electronic equipment all need FPC flexible circuit boards. When designing the corners of the FPC soft board, if the design is not right, the FPC flexible...
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uv Laser systems for wafer serialization, marking and scribing
Apr 27 , 2021
Semiconductor wafer processing typically requires serialization, patterning and roughening operations. And picking the correct laser system for these operations can be complex once you consider all the relevant process variables—such as substrate type, wafer diameter, feature size, slag tolerances, debris volume, throughput and clean room protocols. Whether marking or cutting wafers, lasers ...
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CO2 Laser Marking Glass wafers,Weatherstripping,Electronic PCBs
Apr 30 , 2021
CO2 Laser Marking On this page, we explain marking examples and characteristics of CO2 laser markers, which are perfect for applications such as marking resin and paper or processing films. Applications Mechanism and Characteristics of CO2 Lasers Product Introduction Applications CO2 lasers have the longest wavelength of all commonly used lasers, more than ten times longer than that of stan...
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