UV laser etching PCB circuit board faster and higher precision

Ultraviolet lasers are used in the fine processing of various materials such as plastics, glass, metals, ceramics, PCBs, cover films, silicon wafers, etc., and are equipment responsible for multiple manufacturing processes of a single material. Taking PCB manufacturing as an example, ultraviolet lasers are used in multiple processes such as cutting, etching, and drilling.

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In charge of PCB cutting, UV lasers are currently the best choice for cover film cutting, PCB mass cutting and disassembly (removing a single circuit board from the panel). The cover film constitutes the insulating area between the assembly components of the multilayer circuit board, which is used for environmental isolation and electrical insulation, and protects fragile conductors. It needs to be cut according to a specific shape, and the use of a fine ultraviolet laser can avoid damaging the release paper, so that the formed covering film can be easily separated from the release paper. The flexible or rigid-flex PCB material is very thin. The UV laser can not only eliminate the influence of mechanical stress generated during the disassembly process, but also greatly reduce the influence of thermal stress.

PCB etching is in charge. The process of PCB from the light board to showing the circuit pattern is a complicated process, among which, etching is required. Compared with the chemical etching of the pattern plating method, the ultraviolet laser etching is faster and more environmentally friendly. At the same time, the UV laser spot size can reach 10μm, and the etching accuracy is higher.

PCB drilling is in charge. Multi-layer PCBs are made of composite materials by hot die-casting together to form semi-cured parts, which are easily separated when exposed to high temperatures. The UV laser with the reputation of "cold" processing can therefore flex its muscles. Ultraviolet laser technology is widely used in the production of micropores with a diameter of less than 100μm. With the use of miniature circuit diagrams, the aperture can even be less than 50μm. Ultraviolet laser technology produces very high yields when making holes less than 80μm in diameter. In order to meet the increasing demand for micro-hole productivity, many manufacturers have begun to introduce dual-head UV laser drilling systems.