UV laser cutting technology for cutting wafers, ceramics, glass, circuit boards and ITO dry etching

With the gradual maturity of ultraviolet lasers and the increase of stability, the laser processing industry has shifted from infrared lasers to ultraviolet lasers. At the same time, the application of ultraviolet lasers is becoming more and more popular, and laser applications are moving towards a wider field.

UV Laser Wafer Cutting

The surface of the sapphire substrate is hard, and it is difficult for a cutter wheel to cut it, and the wear rate is large, the yield is low, and the cutting path is larger than 30 μm, which not only reduces the use area, but also reduces the output of the product. Driven by the blue-and-white LED industry, the demand for sapphire substrate wafer cutting has increased significantly, which has put forward higher requirements for improving productivity and finished product pass rate.

UV Laser Ceramic Cutting

In the last century, the application of electronic ceramics has gradually matured and has a wider range of applications, such as heat dissipation substrates, piezoelectric materials, resistors, semiconductor applications, and biological applications. the field of laser processing. According to the material types of ceramics, it can be divided into functional ceramics, structural ceramics and bioceramics. The lasers that can be used to process ceramics include CO2 laser, YAG laser, green laser, etc., but with the gradual miniaturization of components, ultraviolet laser processing has become a necessary processing method, which can process various types of ceramics.

UV Laser Glass Cutting

Driven by the rise of smart phones, the application of ultraviolet lasers gradually has room for development. In the past, due to the limited functions of mobile phones and the high cost of laser processing, laser processing did not occupy much position in the mobile phone market, but now smart phones have many functions and high integration. There are ten types of sensors and hundreds of functional devices, and the cost of components is high, so the requirements for accuracy, yield and processing are greatly increased, and ultraviolet lasers have developed a variety of applications in the mobile phone industry.

UV laser ITO dry etching

The biggest feature of smart phones is the function of the touch screen. The capacitive touch screen can achieve multi-touch, corresponding to the resistive touch screen, which has a longer life and faster response. Therefore, the capacitive touch screen has become the mainstream choice for smart phones.

In the past, the etching method of the ITO circuit was wet etching. The yellow light process was used to make the circuit, and then the ITO film on the surface was removed through the etching solution to form the circuit, which was not only time-consuming but also caused pollution. The use of UV laser cutting has the following characteristics:

1) Good quality: UV lasers with international advanced technology have the advantages of good beam quality, small focusing spot, uniform power distribution, small thermal effect, small slit width and high cutting quality;

2) High precision: with high-precision galvanometer and platform, the precision is controlled in the order of microns;

3) No pollution: ITO is removed by laser, no chemicals, no pollution to the environment, no harm to operators, environmental protection and safety;

4) Fast speed: the CAD graphics can be loaded directly, and the operation can be done without the need for exposure and development processes, eliminating the cost and time of mask production, and speeding up the development speed;

5) Low cost: No need for yellow light and wet process equipment, which reduces the construction cost by more than 30% compared with the original wet process production line. There are no other consumables in the production process, which reduces the production cost.

UV laser circuit board cutting

Laser cutting of circuit boards was first used for flexible circuit board cutting. Because of the wide variety of circuit boards, molds were used for early processing. However, the production cost of molds is high and the production cycle is long. Therefore, the use of ultraviolet laser processing can eliminate the need for mold production. cost and cycle time, greatly improving the sample production time.