Ultraviolet laser processing - the new favorite of brittle materials, you know

Laser manufacturing technology is based on the physical interaction between high-energy lasers and materials, and the processing effect of materials is achieved through gasification, ablation and modification of materials. Today, laser processing has rapidly entered all walks of life. At present, it is mainly metal material processing, accounting for more than 80% of the entire laser processing application. Corresponding iron, copper, and aluminum alloys are hard materials, have good laser processing effects, and are easy to apply to laser processing. For some common metal laser cutting and welding applications, it may only be necessary to solve the corresponding optical power, and the research requirements for processing are not strict.

In fact, many non-metallic materials are used in high-end manufacturing fields of life, such as soft materials, thermoplastic materials, heat-sensitive materials, ceramic materials, semiconductor materials, glass and other brittle materials. If these materials are to be laser processed, the requirements for beam characteristics, degree of ablation, and material damage control are stringent. It is required to realize ultra-fine processing at the micro-nano level. Common infrared lasers are often difficult to achieve this effect, and ultraviolet lasers are a suitable choice.

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UV laser technology has a variety of uses.

Ultraviolet lasers are light whose output beams lie in the ultraviolet spectrum and are invisible to the naked eye. There are two commonly used industrial UV lasers: solid crystal UV lasers and gas UV lasers. The frequency tripled infrared all-solid-state laser can obtain ultraviolet laser output. The wavelength is 355nm. Currently, pulse widths have been successfully developed from nanoseconds to picoseconds. Excimer laser is a common gas UV laser, mainly used in ophthalmic surgery, chip lithography and other fields. In recent years, fiber lasers have developed UV-band products represented by picosecond UV fiber lasers.

Ultraviolet laser has large heat loss and high cost in frequency doubling conversion. Currently, it is difficult to achieve high power. Ultraviolet lasers are considered a cold light source. UV laser processing is called cold working and is suitable for the processing of brittle materials.

UV laser processing of commonly used brittle materials.

Glass is a material widely used in life. From drinking glasses, wine glasses, containers to glass jewelry, pattern making on glass is often a challenge. Traditional processing methods result in a high rate of glass damage. Ultraviolet lasers are ideal for marking and patterning glass surfaces, enabling ultra-fine production. Ultraviolet laser marking makes up for the shortcomings of low processing accuracy, difficult drawing, damage to workpieces, and environmental pollution in the past. With its unique processing advantages, it has become the new favorite of glass products processing, and has been listed as a necessary processing tool by various wine glasses, craft gifts and other industries.

Ceramic materials are widely used in construction, utensils, decorations, etc. Ceramics have a wide range of applications in electronic products and devices. Mobile phone merchants have launched ceramic back covers, ceramic plug-ins, ceramic substrates, ceramic packaging bases, ceramic cover plates for fingerprint identification systems, etc., which are widely used in the fields of mobile communications, optical communications and electronic products. The fabrication of these ceramic components is delicate, and UV laser cutting is currently the ideal choice.

Ultraviolet laser wafer cutting: The surface of the sapphire substrate is hard, the ordinary cutter head is difficult to cut, the wear is large, the yield is low, and the cutting path is greater than 30μm. Reduce the use area and reduce product output. Driven by the sapphire and white LED industries, the demand for wafer dicing on sapphire substrates has increased significantly, which places higher demands on improving productivity and yield. Ultraviolet laser cutting silicon wafers can achieve high-precision cutting, smooth cutting, and greatly improve the yield.

Quartz cutting is a difficult problem in the industry. In the traditional processing method, the "emery stone saw blade" is commonly used, and the "hard hitting hard" processing method is also used. Quartz is fragile and difficult to machine, and a diamond saw blade is a consumable.

Ultraviolet laser has an ultra-high precision of ±0.02mm, which can fully guarantee precise cutting requirements. In the face of quartz cutting, precise control of power can make the cut surface very smooth, and the speed is much faster than manual processing. All parameters can be displayed in full digital, and different parameters can be precisely adjusted by computer, which is more intuitive than accurate, and the difficulty of getting started is much lower than that of manual cutting.