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15W nanosecond solid-state UV laser high-precision marking PCB FPC two-dimensional code
Apr 15 , 2021
15W nanosecond solid-state UV laser high-precision marking PCB FPC two-dimensional code, one-dimensional code, characters PCB circuit board has high wiring density, small size and light weight, which is conducive to the development of smart phone electronic equipment in the direction of high density, high integration, packaging, miniaturization and multilayer; especially the bending resistance of ...
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355nm UV laser for automatic marking of QR code on PCB/FPCB surface
Apr 15 , 2021
355nm UV laser for automatic marking of QR code on PCB/FPCB surface PCB circuit board has high wiring density, small size and light weight, which is conducive to the development of smart phone electronic equipment in the direction of high density, high integration, packaging, miniaturization and multilayer; especially the bending resistance of FPC flexible boards, Precision, better applicat...
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Internal and external green laser marking of glass
Apr 15 , 2021
Whether you need an internal mark or surface etching, our laser glass marking systems can meet your needs. Due to its many advantages over traditional marking techniques, laser marking is found in an increasing number of industries—bringing flexibility, speed and repeatability to your application. Other advantages include: No consumables. Laser marking doesn’t require extra cons...
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0.02mm high-precision S9 UV laser is more suitable for PE film date printing
Apr 16 , 2021
0.02mm high-precision S9 UV laser is more suitable for PE film date printing PE film has a density of about 0.92g/cm3, good heat-sealability, waterproof and moisture-proof; low tensile strength, high tensile elongation, easy to wrinkle, and more easily deformed when heated. Therefore, when drying, the surface temperature of the film should not be too high (within 55 degrees). PE film can be used a...
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Cold light source UV laser can avoid heat deformation of PE film when marking date
Apr 16 , 2021
Cold light source UV laser can avoid heat deformation of PE film when marking date PE film has a density of about 0.92g/cm3, good heat-sealability, waterproof and moisture-proof; low tensile strength, high tensile elongation, easy to wrinkle, and more easily deformed when heated. Therefore, when drying, the surface temperature of the film should not be too high (within 55 degrees). PE film can be ...
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S9 ultraviolet laser is especially suitable for PE film coding, with high light stability
Apr 16 , 2021
S9 ultraviolet laser is especially suitable for PE film coding, with high light stability PE film has a density of about 0.92g/cm3, good heat-sealability, waterproof and moisture-proof; low tensile strength, high tensile elongation, easy to wrinkle, and more easily deformed when heated. Therefore, when drying, the surface temperature of the film should not be too high (within 55 degrees). P...
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Using UV laser marking, Safe, non-contact etching for printed circuit boards
Apr 16 , 2021
Using UV laser marking, Safe, non-contact etching for printed circuit boards PCB marking—including etching codes, numbers and logos onto circuit boards—is necessary for inventory control and tracking. Many conventional methods, however, are time consuming and require additional consumables and cleaning processes. Our fully automated PCB laser marking systems overcome these challenges. ...
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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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tempered glass be cut or drilled by 532nm green laser
Apr 21 , 2021
tempered glass be cut or drilled by 532nm green laser
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S9 UV laser engraves on black plastic plastic at high speed, clear and undistorted
Apr 22 , 2021
S9 UV laser engraves on black plastic plastic at high speed, clear and undistorted Mr. Zhang, runs a processing enterprise that produces various data lines, with 10,000 square meters of workshops, equipped with advanced production equipment, and can provide one-stop solutions from data line style development, design, production and sales. Since working with RFH for more than three ye...
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