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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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355 UV laser marking plastic charging head, neat and smooth, no residue
May 22 , 2021
355 UV laser marking plastic charging head, neat and smooth, no residue Chargers are indispensable in our daily lives. They can use high-frequency power technology and can reasonably use advanced intelligent dynamic adjustment charging technology. Chargers are used in all corners of our lives. Whether it is a mobile phone, a computer or a household appliance, it needs the connection of the chargin...
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The plastic shell of the charger (charging head) can be used for high-speed marking with UV laser
May 22 , 2021
The plastic shell of the charger (charging head) can be used for high-speed marking with UV laser Chargers are indispensable in our daily lives. They can use high-frequency power technology and can reasonably use advanced intelligent dynamic adjustment charging technology. Chargers are used in all corners of our lives. Whether it is a mobile phone, a computer or a household appliance, it needs the...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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The advantages of UV laser cutting technology in the semiconductor industry
May 22 , 2021
The advantages of UV laser cutting technology in the semiconductor industry In recent years, with the increase of device integration, chip size and cutting lane width have been shrinking accordingly. The thickness of wafers and chips is getting thinner and thinner, but due to the brittleness of semiconductor materials, traditional cutting methods will produce mech...
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nanosecond green laser will not scorch when marking automobile plastic parts
May 24 , 2021
nanosecond green laser will not scorch when marking automobile plastic parts Why BYD auto parts manufacturers choose RFH 532 green laser? RFH green laser can mark the required graphics and words on the surface of automobile glass or plastic parts. Because the precise focusing spot of the green laser is extremely small, and the processing heat-affected zone is small, it will not produce ther...
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Nanosecond UV Laser marks Electronic Cigarette shell at high speed without pause
May 25 , 2021
Nanosecond UV Laser marks Electronic Cigarette shell at high speed without pause The brand image and words that need to be marked on the e-cigarette shell are an important part of highlighting the quality of e-cigarettes. The past ink-jet coding technology is no longer suitable for marking the surface of e-cigarettes. More manufacturers have begun to choose RFH UV laser marking technology. ...
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uv laser marking packaging industry
May 26 , 2021
Laser technology has been applied in packaging industry. For example, two-dimensional code marked on the carton cigarette or box cigarette for sales management, anti-fake code marked on medical bags and production date marked on PET bottle etc. The development of mobile network speed, smartphone performance, and online payment functions has promoted the popularization of QR codes. The fast ...
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High-power picosecond deep-UV source via group velocity matched frequency conversion
May 28 , 2021
Powerful ultrashort pulses in the deep-ultraviolet (deep-UV) are beneficial for diverse applications from fundamental science to industrial materials processing. However, reaching high powers via conventional approaches is challenging due to three central issues: dispersion, multiphoton absorption, and optical damage. Here, we simultaneously overcome these issues with a novel fifth-harmonic genera...
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The food packaging bag is marked with a UV laser, strong anti-counterfeiting
May 31 , 2021
The food packaging bag is marked with a UV laser, strong anti-counterfeiting Food packaging UV laser marking, both eye-catching and at ease UV laser marking food packaging date, so you can eat at ease In the current rapidly changing food market, the exquisiteness and design of food packaging can greatly affect consumers' choices and purchases. Good food packaging not only needs to have a re...
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532nm green laser can stably mark on curved Erguotou wine bottles
May 31 , 2021
532nm green laser can stably mark on curved Erguotou wine bottles 532 green laser marking the date of glass wine bottles, can stand the baptism of time For coding on glass wine bottles, the green laser can also maintain superior beam quality Erguotou is deeply loved by the public among the drinks, and its hearty feeling cannot be replaced by beer or other alcoholic beverages. Nowadays, Ergu...
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Plastic laser marking is inseparable from the "cold light" of solid-state ultraviolet lasers
May 31 , 2021
3W5W lasers have inserted high-tech wings for the leap of 3C products The 3W-10W laser allows users to obtain high-quality beams without making a large optical path Plastic laser marking is inseparable from the "cold light" of solid-state ultraviolet lasers Human life in the 21st century is inseparable from 3C products. Generally speaking, 3C products are computers, mobile phones, cameras, ...
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