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Picosecond laser cutting machine helps the development of thin-film solar cells
May 18 , 2021
Picosecond laser cutting machine helps the development of thin-film solar cells Among all solar thin-film battery materials, CIGS (copper indium gallium selenium) battery has the highest absorption coefficient for visible light, and the consumption of raw materials is much lower than that of traditional crystalline silicon solar cells. Compared with high-efficienc...
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Why do thin-film solar cells need to be cut with a UV laser?
May 18 , 2021
Why do thin-film solar cells need to be cut with a UV laser? Solar energy is one of the main clean and renewable new energy sources to replace fossil energy in the future. As a relatively mature solar cell currently very promising, thin-film solar cells have the advantages of saving raw materials, low cost, good weak light absorption, and being able to produce large-are...
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Picosecond laser etching of PI film solar cells
May 20 , 2021
Picosecond laser etching of PI film solar cells Solar thin film batteries can be divided into two categories: hard substrates and flexible substrates. Flexible thin-film solar cells refer to thin-film solar cells made on flexible materials (such as stainless steel, polyimide, etc.). Compared with thin-film solar cells on hard substrates (such as glass), flexible t...
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Advantages of laser cutting solar PI film screen
May 20 , 2021
Advantages of laser cutting solar PI film screen At present, the mainstream solar screen processing is to use the exposure method to make electrode patterns on photosensitive materials; laser cutting is a revolutionary screen processing technology that contributes to the industry's cost reduction and efficiency enhancement. Compar...
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Advantages of UV laser cutting PI film
May 20 , 2021
Advantages of UV laser cutting PI film With the development of laser technology, the use of UV laser cutting PI cover film gradually replaces the traditional die cutting. Ultraviolet laser cutting is a non-contact processing, no expensive molds are needed, and the production cost is greatly reduced. The focused spot can be only a dozen micrometers, which can meet...
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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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Laser cutting is the future development direction of lithium battery processing
May 21 , 2021
Laser cutting is the future development direction of lithium battery processing Laser cutting technology is the future development direction of lithium battery processing. Laser cutting technology has the characteristics of controllable processing, high efficiency, and high quality. It has a very broad application in the industrial processing of lithium batteries. Laser...
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Laser cutting sapphire LED chip
May 21 , 2021
Laser cutting sapphire LED chip The development of LED chips continues to develop in the direction of high efficiency and high brightness. Traditional chip cutting methods such as diamond scribing and grinding wheel sawing are gradually outdated due to their low efficiency and low yield, and cannot meet the needs of modern production. At present, laser cutting met...
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The application prospects of laser cutting technology on solar cells
May 22 , 2021
The application prospects of laser cutting technology on solar cells Thin-film solar cell products can be divided into two types: crystalline silicon thin-film batteries and other thin-film batteries. The former includes monocrystalline silicon cells and polycrystalline silicon cells. Wafer cutting is the key to the production of monocrystalline silicon cells. Wir...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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The advantages of UV laser cutting technology in the semiconductor industry
May 22 , 2021
The advantages of UV laser cutting technology in the semiconductor industry In recent years, with the increase of device integration, chip size and cutting lane width have been shrinking accordingly. The thickness of wafers and chips is getting thinner and thinner, but due to the brittleness of semiconductor materials, traditional cutting methods will produce mech...
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Application of laser cutting in medical equipment
May 22 , 2021
Application of laser cutting in medical equipment In recent years, laser cutting has become more and more widely used in the production and application of medical devices. Due to the characteristics of high processing accuracy, fast speed, non-contact cutting, and flexible processing, laser cutting machines have become a common production tool in the medical devic...
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