PI film cutting artifact - RFH industrial grade 355nm UV nanosecond solid-state laser

PI film, also known as polyimide film, refers to a class of polymers containing imide rings on the main chain. The material has excellent mechanical properties, electrical properties, high radiation resistance, wear resistance and oil resistance. It is widely used in aerospace, consumer electronics, photovoltaics and other fields, and has the reputation of "gold film".

In the processing method of PI, laser cutting is gradually replacing the traditional die-cutting process and has become an important tool for PI film processing.

Why choose 355nm UV laser?

In the chemical bond structure of the PI film, the chemical bond energies of the C-C bond and the C-N bond are about 3.4eV and 3.17eV, respectively, and the single-photon energy of the UV laser is about 3.5eV, so when the UV laser acts on the PI film, it can directly The two chemical bonds are broken to achieve cleavage.

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The user can choose the industrial-grade 355nm UV nanosecond solid-state laser developed and designed by RFH, the 355nm UV laser generated, the higher single photon energy makes the material high absorption rate, the heat effect is small, and the processing accuracy is higher, more than 30W The output power is higher, and the cutting efficiency is higher.

Why choose narrow pulse width?

The laser pulse width affects the thermal damage caused by the thermal energy generated by the laser to the material. The smaller the pulse width, the smaller the thermal damage. The pulse width of this 355nm UV laser is very small (<25ns@100kHz), which can bring a smaller heat-affected zone, effectively reduce the thermal damage of the laser to the material, reduce carbonization, and realize fine processing.

Moreover, the use of laser cutting PI film does not require a mold, which helps to reduce costs and increase efficiency; the cutting edge is smooth, the processing accuracy is high, and the use is flexible enough to cope with the increasingly sophisticated, miniaturized, and high-density FPC trends.

Benefiting from the excellent characteristics of PI film, its application has been continuously improved. In more and more diverse applications, higher requirements are placed on the PI film laser cutting process. RFH will closely follow the general trend of the industry and the actual needs of users, explore the forefront of laser technology, continuously innovate technology, optimize products, improve manufacturing processes, and provide users with better domestic lasers.