-
UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
view more
-
Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
view more
-
UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
view more
-
Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
view more
-
Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
view more
-
532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
view more
-
Customers purchase 5 355nm UV lasers for PCB/FPCB processing
Apr 23 , 2021
Customers purchase 5 355nm UV lasers for PCB/FPCB processing Ultraviolet laser can mark various characters, symbols and patterns on the surface of circuit board PCB/FPCB, and the character size can range from millimeters to micrometers. In addition to effective anti-counterfeiting, it can also realize the control and traceability of product quality. Whether it is fine processing or processi...
view more
-
Nanosecond UV laser engraving PCB circuit board QR code will not fade or fall off
Apr 23 , 2021
Nanosecond UV laser engraving PCB circuit board QR code will not fade or fall off Ultraviolet laser can mark various characters, symbols and patterns on the surface of circuit board PCB/FPCB, and the character size can range from millimeters to micrometers. In addition to effective anti-counterfeiting, it can also realize the control and traceability of product quality. Whether it is fine p...
view more
-
355nm UV laser etching PCB/FPCB circuit board
Apr 23 , 2021
355nm UV laser etching PCB/FPCB circuit board Ultraviolet laser can mark various characters, symbols and patterns on the surface of circuit board PCB/FPCB, and the character size can range from millimeters to micrometers. In addition to effective anti-counterfeiting, it can also realize the control and traceability of product quality. Whether it is fine processing or processing efficiency, ...
view more
-
Laser depaneling and singulation for PCB complex circuit boards
Apr 25 , 2021
PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology shines TRADITIONAL VERSUS LASER DEPANELING Mainstream depaneling methods utilize routers, die cutters a...
view more
-
High-speed, reliable laser systems for pharmaceutical tablet drilling
Apr 26 , 2021
Laser drilling is a proven, economically viable way to create sub-millimeter apertures in pharmaceutical tablets. These apertures play an important role in modern drug delivery systems, which provide many health benefits like decreasing dosing frequencies, achieving consistent drug concentrations in the blood and enabling customized delivery profiles. Osmotic drug delivery systems are especially v...
view more
-
FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology
Apr 27 , 2021
FPC flexible circuit boards need to use ultraviolet laser drilling, cutting, and scribing technology Our common mobile phones, TVs, computers, kitchen induction cookers, rice cookers, range hoods, chargers, remote controls and other electronic equipment all need FPC flexible circuit boards. When designing the corners of the FPC soft board, if the design is not right, the FPC flexible...
view more
