Nanosecond laser is available, another FPC laser cutting tool was born

With the further development of the 3C market, electronic products are trending towards miniaturization and intelligence. The flexible circuit board FPC, which is an important component and a circuit connection carrier, is becoming thinner and thinner, and the components it accommodates are becoming more and more dense. These trends require higher and higher processing accuracy.

With the unique advantages of UV lasers, UV lasers are more and more widely used in FPC cutting, and are gradually replacing the traditional FPC cutting process.

Disadvantages of traditional cutting process

The traditional FPC processing of flexible circuit boards adopts methods such as die and stamping. This type of processing brings visible disadvantages. First, the mechanical contact-type sub-board process is prone to deformation, burrs, and even damage to the element under the action of external stress. The second is that the precision is not high, and it is no longer applicable to some high-precision FPCs, which is likely to cause low yields; the third is that some customized shape FPC materials cannot be processed efficiently.

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The cutting results of CO2 infrared lasers are also unsatisfactory, because a large heat-affected area is easily generated during the cutting process, which interferes with the cutting accuracy, and even causes scorching and deformation, uneven incision and poor quality.

If the industrial-grade nanosecond solid-state laser developed by RFH is used, it can bring very good processing effects. The central wavelength of 355nm ultraviolet laser can be selected, and the beam quality is high, which can well solve the above problems.

First of all, the 355nm UV laser has high single-photon energy and small pulse width (<20ns), resulting in low thermal effect and not easy to burn, especially for PI film and release paper that are sensitive to thermal effects in FPC materials , the advantages of UV laser cold processing are obvious;

Secondly, compared with traditional mechanical processing, laser processing does not have direct contact, does not generate mechanical force, causes little damage to materials, and can also process specific graphics with high processing efficiency;

Again, this industrial-grade nanosecond solid-state laser has excellent beam quality (M2 < 1.2), and the focused spot diameter is as low as micron, resulting in a narrow incision width and smooth incision edges, so the density of circuit components can be maximized. Fully exploit the potential of the circuit board;

In addition, the use of laser processing does not require any consumables, and the processing speed is fast. While FPC is cutting, it can also assist in marking, which is helpful for product supervision or traceability.

In fact, this industrial-grade nanosecond solid-state laser developed and designed by RFH can not only be used for FPC cutting, but also can be used for precision micromachining of thin, brittle and other metal and non-metallic materials, such as PCB board cutting, drilling Holes, glass, sapphire cutting, etc., the scope of application is very wide, convenient for users to use flexibly.