Perform PCB/SIP drilling, cutting, trenching, and de-paneling, plus flex/LCP/LTCC processing, with minimized heat-affected zone and no post-cleaning needed. The AVIA LX combines high pulse energy and repetition rate with UV and Green output to enable rapid, precision materials processing in semi fab, advanced packaging, and solar cell manufacturing. It offers exceptional reliability for a high-power laser source. Select from three different output powers, each of which can operate over a range of peak powers and repetition rates to allow optimization for specific materials.