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Internal and external green laser marking of glass
Apr 15 , 2021
Whether you need an internal mark or surface etching, our laser glass marking systems can meet your needs. Due to its many advantages over traditional marking techniques, laser marking is found in an increasing number of industries—bringing flexibility, speed and repeatability to your application. Other advantages include: No consumables. Laser marking doesn’t require extra cons...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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RFH UV laser is especially suitable for laser lettering and typing on switch panel
Apr 26 , 2021
RFH UV laser is especially suitable for laser lettering and typing on switch panel In the old days, there were no marked buttons on the switch panel. We would find stickers or handwriting on the surface, which one is "on the light" or "off the light". This method is neither beautiful nor durable. However, since the popularization and application of ultraviolet laser technology in plastic sw...
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Permanent laser marks for industrial cables and wires
Apr 27 , 2021
Each year, billions of feet of cabling are installed around the world—requiring some kind of marking. Compared to other methods, laser wire marking offers unmatched precision, flexibility and speed without damaging the insulation or sheathing. THE ADVANTAGES OF LASER MARKERS Wire marks typically combine manufacturing information with product identification—though some additional marks ...
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Non-contact marking of plastic materials with 355nm UV laser
Apr 30 , 2021
Non-contact marking of plastic materials with 355nm UV laser New Era Securities analysis pointed out that the current national helmet penetration rate is extremely low. It is conservatively estimated that the production and sales of helmets will not exceed 50 million yuan per year. The demand for new helmets may exceed 300 million. If the average price is 100 yuan per piece, it corresponds ...
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CO2 Laser Marking Glass wafers,Weatherstripping,Electronic PCBs
Apr 30 , 2021
CO2 Laser Marking On this page, we explain marking examples and characteristics of CO2 laser markers, which are perfect for applications such as marking resin and paper or processing films. Applications Mechanism and Characteristics of CO2 Lasers Product Introduction Applications CO2 lasers have the longest wavelength of all commonly used lasers, more than ten times longer than that of stan...
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Picosecond laser etching of PI film solar cells
May 20 , 2021
Picosecond laser etching of PI film solar cells Solar thin film batteries can be divided into two categories: hard substrates and flexible substrates. Flexible thin-film solar cells refer to thin-film solar cells made on flexible materials (such as stainless steel, polyimide, etc.). Compared with thin-film solar cells on hard substrates (such as glass), flexible t...
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How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
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The plastic shell of the charger (charging head) can be used for high-speed marking with UV laser
May 22 , 2021
The plastic shell of the charger (charging head) can be used for high-speed marking with UV laser Chargers are indispensable in our daily lives. They can use high-frequency power technology and can reasonably use advanced intelligent dynamic adjustment charging technology. Chargers are used in all corners of our lives. Whether it is a mobile phone, a computer or a household appliance, it needs the...
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