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Picosecond laser cutting machine helps the development of thin-film solar cells
May 18 , 2021
Picosecond laser cutting machine helps the development of thin-film solar cells Among all solar thin-film battery materials, CIGS (copper indium gallium selenium) battery has the highest absorption coefficient for visible light, and the consumption of raw materials is much lower than that of traditional crystalline silicon solar cells. Compared with high-efficienc...
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Picosecond laser etching of PI film solar cells
May 20 , 2021
Picosecond laser etching of PI film solar cells Solar thin film batteries can be divided into two categories: hard substrates and flexible substrates. Flexible thin-film solar cells refer to thin-film solar cells made on flexible materials (such as stainless steel, polyimide, etc.). Compared with thin-film solar cells on hard substrates (such as glass), flexible t...
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How does UV laser cut MEMS wafers
May 20 , 2021
How does UV laser cut MEMS wafers MEMS (Micro-Electro-Mechanical System) is a micro-electro-mechanical system, generally composed of micro-mechanical structure, micro-sensor, micro-actuator and control circuit. MEMS is a chip that realizes the conversion between different energy forms through semiconductor technology. The dicing method of MEM...
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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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The advantages of UV laser cutting technology in the semiconductor industry
May 22 , 2021
The advantages of UV laser cutting technology in the semiconductor industry In recent years, with the increase of device integration, chip size and cutting lane width have been shrinking accordingly. The thickness of wafers and chips is getting thinner and thinner, but due to the brittleness of semiconductor materials, traditional cutting methods will produce mech...
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nanosecond green laser will not scorch when marking automobile plastic parts
May 24 , 2021
nanosecond green laser will not scorch when marking automobile plastic parts Why BYD auto parts manufacturers choose RFH 532 green laser? RFH green laser can mark the required graphics and words on the surface of automobile glass or plastic parts. Because the precise focusing spot of the green laser is extremely small, and the processing heat-affected zone is small, it will not produce ther...
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Nanosecond UV Laser marks Electronic Cigarette shell at high speed without pause
May 25 , 2021
Nanosecond UV Laser marks Electronic Cigarette shell at high speed without pause The brand image and words that need to be marked on the e-cigarette shell are an important part of highlighting the quality of e-cigarettes. The past ink-jet coding technology is no longer suitable for marking the surface of e-cigarettes. More manufacturers have begun to choose RFH UV laser marking technology. ...
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High-power picosecond deep-UV source via group velocity matched frequency conversion
May 28 , 2021
Powerful ultrashort pulses in the deep-ultraviolet (deep-UV) are beneficial for diverse applications from fundamental science to industrial materials processing. However, reaching high powers via conventional approaches is challenging due to three central issues: dispersion, multiphoton absorption, and optical damage. Here, we simultaneously overcome these issues with a novel fifth-harmonic genera...
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532nm green laser can stably mark on curved Erguotou wine bottles
May 31 , 2021
532nm green laser can stably mark on curved Erguotou wine bottles 532 green laser marking the date of glass wine bottles, can stand the baptism of time For coding on glass wine bottles, the green laser can also maintain superior beam quality Erguotou is deeply loved by the public among the drinks, and its hearty feeling cannot be replaced by beer or other alcoholic beverages. Nowadays, Ergu...
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Whitening effect of S9 nanosecond ultraviolet laser on black plastic
May 31 , 2021
Whitening effect of S9 nanosecond ultraviolet laser on black plastic 3W-10W laser strikes black in white plastic, no touch, clear writing The power of word-of-mouth communication! Plastic marking customer orders new product S9 UV laser Quality creates trust, and word-of-mouth communication is unstoppable. Manager Zhou from Anhui, I heard from friends that the RFH laser has high stability, s...
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Nanosecond solid-state green laser internal engraving glass
Jun 01 , 2021
532 Green Laser Laser Engraving Glass, Blooming Inner Beauty Nanosecond solid-state green laser internal engraving glass The RFH 30W green light is used by foreign customers to engrave the glass interior Green laser internal adjustment technology is a processing technology that uses a laser to inject a certain wavelength of laser into the glass or crystal, so that a specific part of the ins...
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