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Fast, flexible laser marking for pharmaceutical tablets
Apr 15 , 2021
As pharmaceutical manufacturing continues to evolve, you need tools that are readily adaptable and easy to implement. Your tablet marking systems must be able to change information quickly—adjusting to multiple shapes and sizes without halting production. Ink marking methods can smear, make contact with the tablet and require regular maintenance—adding extra steps to your manufa...
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Using UV laser marking, Safe, non-contact etching for printed circuit boards
Apr 16 , 2021
Using UV laser marking, Safe, non-contact etching for printed circuit boards PCB marking—including etching codes, numbers and logos onto circuit boards—is necessary for inventory control and tracking. Many conventional methods, however, are time consuming and require additional consumables and cleaning processes. Our fully automated PCB laser marking systems overcome these challenges. ...
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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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UV LASER FOR PLASTIC CUTTING
Apr 16 , 2021
Using lasers to cut plastic achieves precise, fast and repeatable cuts in many types of polymers. Compared to traditional cutting methods, laser systems offer many advantages like precise laser control, high accuracy and speed. Others include: Non-contact cuts. Lasers eliminate cleaning, sharpening and replacing cutting blades. Small kerf widths. Focused, localized laser energy creates very narrow...
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Pet film processing customers use peer UV lasers to reduce the power of 3W to 1.5W
Apr 19 , 2021
Pet film processing customers use peer UV lasers to reduce the power of 3W to 1.5W PET film, also known as high temperature resistant polyester film, has the characteristics of good transparency, non-toxicity, impermeability, and light weight. Therefore, it is often used to make packaging materials such as edible oil bottles, condiment bottles, and cosmetic bottles. But to mark the production date...
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Laser cutting, engraving and marking PET film, UV laser moves at a high speed of 5-7 meters/second
Apr 19 , 2021
Laser cutting, engraving and marking PET film, UV laser moves at a high speed of 5-7 meters/second PET film marking production date, code, two-dimensional code, non-UV laser must be PET film, also known as high temperature resistant polyester film, has the characteristics of good transparency, non-toxicity, impermeability, and light weight. Therefore, it is often used to make packagin...
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PET film marking production date, code, two-dimensional code, non-UV laser must be
Apr 19 , 2021
PET film marking production date, code, two-dimensional code, non-UV laser must be PET film, also known as high temperature resistant polyester film, has the characteristics of good transparency, non-toxicity, impermeability, and light weight. Therefore, it is often used to make packaging materials such as edible oil bottles, condiment bottles, and cosmetic bottles. But to mark the producti...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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