Is 355nm laser module suitable for glass marking?

Features of 355nm laser module marking machine

1. Due to the extremely small focusing spot and the small processing heat affected zone, the ultraviolet laser can carry out ultra-fine marking and is the first choice for customers who have higher requirements on the marking effect;

2. In addition to copper materials, 355nm laser modules are suitable for a wider range of materials;

3. Not only the beam quality is good, the focusing spot is smaller, and ultra-fine marking can be realized;

4. The scope of application is wider: the heat-affected area is extremely small, no thermal effect will occur, and no material scorching problem will occur;

5. The marking speed is fast and the efficiency is high; the performance of the whole machine is stable, the size is small, and the power consumption is low;

Product advantages of 355nm laser module marking machine

Power saving, no consumables for three years, ultra-low cost of use, high speed.

One-time investment, three-year maintenance-free, no consumables, save the trouble of daily pungent cleaning of the ink jet printer and the burden of 50,000-60,000 yuan of ink consumables per year.

Dongguan 355nm laser module Marking Machine

Applicable industries of 355nm laser module marking machine

The 355nm laser module marking machine is developed with a 355nm 355nm laser module. Compared with the infrared laser, the machine adopts the third-order intracavity frequency doubling technology. Compared with the infrared laser, the 355 UV light focusing spot is very small. The effect of marking is to directly interrupt the material by the short wavelength laser. It is mainly used for ultra-fine marking and engraving, especially suitable for marking food, pharmaceutical packaging materials, drilling micro-holes, and glass materials. High-speed division and complex pattern cutting of silicon wafers and other application industries.

Applicable materials for 355nm laser module marking machine

1. It is suitable for surface marking and micro-hole processing of glass, polymer materials and other objects.

2. Widely used in the surface marking of packaging bottles (boxes) of polymer materials such as food, medicine, cosmetics, wires, etc.

3. Flexible PCB board, LCD, TFT marking, dicing and cutting, etc.

4. Metal or non-metal plating removal.

5. Silicon wafer micro-hole and blind-hole processing.