Introduction to the principle and advantages of 10W UV laser marking machine

1. Introduction to the principle of UV laser marking machine

The reaction mechanism of ultraviolet laser processing is realized by photochemical ablation, that is, relying on laser energy to break the bonds between atoms or molecules, so that they become small molecules and vaporize and evaporate. The focused spot is extremely small, and the processing heat-affected zone is minimal, so it can be used for ultra-fine marking and special material marking.

UV laser marking machine

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2. Advantages of UV laser marking machine

1. Ultraviolet laser is a cold light source, and the thermal effect is particularly small during laser cutting or marking, and it is more suitable for deep processing of materials that are more sensitive to thermal effects.

2. Ultraviolet laser has narrower pulse width and higher peak power, so it is easy to process and destroy polymer materials with high requirements.

3. The minimum light spot after focusing by the UV laser can reach 10UM, and the processing heat-affected zone is small, so it can be used for ultra-fine marking, marking of special materials, especially suitable for marking food, medical packaging materials, micro-holes, and glass materials. Application areas such as high-speed division of silicon wafers and complex pattern cutting of silicon wafers.

4. The heat-affected area is extremely small, will not produce thermal effects, and will not cause material burning problems. 5. The scope of application of UV laser marking machine: UV laser can achieve the best marking quality on almost all materials. The wavelength of 355nm further increases the range of marking plastic materials. In addition, when marking metal materials with it, it can also strictly control the heat input. Super-fine LOGO trademark, text, two-dimensional code, pattern, serial number, serial number, symbol, garbled number and other information can be engraved on the product. It is mainly used in the high-end market of ultra-fine processing, 3C industry marking, electronic components, electrical enclosure marking, food, medicine and other polymer materials packaging bottles marking; metal or non-metal coating removal; marking of various materials, Blind groove processing; new-type ultra-thin metal foil micro-hole production, etc. For example: marking and scribing of flexible pcb boards; micro-hole and blind hole processing of silicon wafers; two-dimensional code marking of LCD liquid crystal glass, surface drilling of glassware, marking of metal surface coatings, etc.

5. Imported laser light source, high beam quality, small focus spot, making marking finer and higher definition; small heat-affected area, no thermal effect, avoiding deformation, damage or scorching of processed materials; 3. Applicable materials It is widely used to solve the problems of insufficient detail and poor effect of fiber laser marking for many materials; 4. Imported scanning is adopted, and the marking speed is fast, and it is suitable for micro-cutting and drilling.

6. Free maintenance, no consumables, low cost of use, and energy saving.

7. The function of online flying marking can be realized on the assembly line.