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UV Laser marking of light- and dark-colored plastics
Apr 02 , 2021
Plastic laser marking offers several advantages over competing technologies like superior mark quality and lower cost of ownership. Advantages include: Permanence. With plastic laser marking, the material itself becomes the mark—improving the mark’s durability compared to ink marks or labels. Quality. Lasers have high imaging resolution and can create line widths of only a few microns....
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355nm UV laser is used for drilling, engraving key PCB circuit board
Apr 08 , 2021
355nm UV laser is used for drilling, engraving key PCB circuit board The working principle of the car remote control key is to first send out a weak electric wave through the key, the electric wave signal is received by the car antenna, the signal code is recognized by the electronic control unit, and then the actuator (motor or electromagnetic coil) of the system performs the opening/closing acti...
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355nm laser drilling, cutting and engraving PCB circuit board will not produce burrs
Apr 08 , 2021
355nm laser drilling, cutting and engraving PCB circuit board will not produce burrs The working principle of the car remote control key is to first send out a weak electric wave through the key, the electric wave signal is received by the car antenna, the signal code is recognized by the electronic control unit, and then the actuator (motor or electromagnetic coil) of the system performs t...
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Laser marking, drilling, welding and cutting of metals
Apr 08 , 2021
Laser marking, drilling, welding and cutting of metals
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Laser drilling metal offers superior speed and lower operating costs
Apr 09 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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ADVANTAGES OF LASER DRILLING OF CERAMIC
Apr 12 , 2021
Drilling ceramic using laser energy allows for fast drilling while having precise control of heat, hole placement, and hole quality. Drilling can create through-holes or partial holes for texturing or micromachining requirements. Micro drilling is possible when using short wavelength laser sources giving the ability to drill holes with diameters down to 10’s of microns. Control Micro Systems...
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Laser part marking, handheld etching and welding for automotive manufacturing
Apr 13 , 2021
THE IMPORTANCE OF AUTOMOTIVE PART MARKING Part marking provides critical information to drivers, mechanics, vendors and employees on the production line. These markings—found throughout the vehicle—include barcodes, serial numbers, compliance details and important warning labels. With speed and precision, our lasers can mark plastics, metal alloys and rubber using techniques lik...
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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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Method for testing for blind hole formed in wafer layer
Apr 19 , 2021
A new method for detecting blind holes in the contact layer of a multi-chip semiconductor test wafer makes use of the fact that if the hole is not a blind hole, a subsequent etch step extends the hole a predetermined distance into the layer immediately underlying the contact layer. After a predetermined number of holes have been etched through the contact layer and for a predetermined distance int...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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