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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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UV LASER FOR PLASTIC CUTTING
Apr 16 , 2021
Using lasers to cut plastic achieves precise, fast and repeatable cuts in many types of polymers. Compared to traditional cutting methods, laser systems offer many advantages like precise laser control, high accuracy and speed. Others include: Non-contact cuts. Lasers eliminate cleaning, sharpening and replacing cutting blades. Small kerf widths. Focused, localized laser energy creates very narrow...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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Customers purchase 5 355nm UV lasers for PCB/FPCB processing
Apr 23 , 2021
Customers purchase 5 355nm UV lasers for PCB/FPCB processing Ultraviolet laser can mark various characters, symbols and patterns on the surface of circuit board PCB/FPCB, and the character size can range from millimeters to micrometers. In addition to effective anti-counterfeiting, it can also realize the control and traceability of product quality. Whether it is fine processing or processi...
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Nanosecond UV laser engraving PCB circuit board QR code will not fade or fall off
Apr 23 , 2021
Nanosecond UV laser engraving PCB circuit board QR code will not fade or fall off Ultraviolet laser can mark various characters, symbols and patterns on the surface of circuit board PCB/FPCB, and the character size can range from millimeters to micrometers. In addition to effective anti-counterfeiting, it can also realize the control and traceability of product quality. Whether it is fine p...
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355nm UV laser etching PCB/FPCB circuit board
Apr 23 , 2021
355nm UV laser etching PCB/FPCB circuit board Ultraviolet laser can mark various characters, symbols and patterns on the surface of circuit board PCB/FPCB, and the character size can range from millimeters to micrometers. In addition to effective anti-counterfeiting, it can also realize the control and traceability of product quality. Whether it is fine processing or processing efficiency, ...
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Laser depaneling and singulation for PCB complex circuit boards
Apr 25 , 2021
PCB depaneling and singulation laser systems are gaining popularity—especially as circuit board complexity and component ratios continue to rise. Microelectronics and medical device manufacturers require close tolerances and minimal debris—this is where laser technology shines TRADITIONAL VERSUS LASER DEPANELING Mainstream depaneling methods utilize routers, die cutters a...
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Safe, anti-counterfeiting laser marking for pharmaceutical tablets
Apr 26 , 2021
Marking tablets with simple brand or product identifiers is no longer enough. You must now take steps to ensure your pharmaceuticals are reaching doctors and patients safely and without compromise. Adding identifying marks to tablets before applying the coating is a proven anti-counterfeiting measure. Laser tablet marking systems are integral to this process—allowing you to change marks quic...
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