-
GREEN LASER FOR INTERNAL GLASS MARKING
Apr 07 , 2021
INTERNAL GLASS MARKING This method focuses a laser’s energy into the interior of a glass part—creating microfractures and a visually contrasting mark without affecting the outside surface. Internal glass marking uses 355-nm (Nd:YVO4) or ultrashort lasers. Their small spot sizes have high energy density and absorption rates that can mark precise locations within the glass. By cha...
view more
-
355nm UV laser is used for drilling, engraving key PCB circuit board
Apr 08 , 2021
355nm UV laser is used for drilling, engraving key PCB circuit board The working principle of the car remote control key is to first send out a weak electric wave through the key, the electric wave signal is received by the car antenna, the signal code is recognized by the electronic control unit, and then the actuator (motor or electromagnetic coil) of the system performs the opening/closing acti...
view more
-
355nm laser drilling, cutting and engraving PCB circuit board will not produce burrs
Apr 08 , 2021
355nm laser drilling, cutting and engraving PCB circuit board will not produce burrs The working principle of the car remote control key is to first send out a weak electric wave through the key, the electric wave signal is received by the car antenna, the signal code is recognized by the electronic control unit, and then the actuator (motor or electromagnetic coil) of the system performs t...
view more
-
Green laser for cutting glass
Apr 08 , 2021
GLASS CUTTING Our laser glass cutting systems utilize a melting method that leaves behind no microcracks—eliminating post-cut processing, microcrack removal and microshard cleanup
view more
-
532 green laser for glass nucleation
Apr 08 , 2021
GLASS NUCLEATION Lasers can be used to add tiny grooves to glassware that improves the formation of carbon dioxide bubbles to enhance the drinking experience.
view more
-
Laser marking, drilling, welding and cutting of metals
Apr 08 , 2021
Laser marking, drilling, welding and cutting of metals
view more
-
Laser drilling metal offers superior speed and lower operating costs
Apr 09 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
view more
-
ADVANTAGES OF LASER DRILLING OF CERAMIC
Apr 12 , 2021
Drilling ceramic using laser energy allows for fast drilling while having precise control of heat, hole placement, and hole quality. Drilling can create through-holes or partial holes for texturing or micromachining requirements. Micro drilling is possible when using short wavelength laser sources giving the ability to drill holes with diameters down to 10’s of microns. Control Micro Systems...
view more
-
Internal and external green laser marking of glass
Apr 15 , 2021
Whether you need an internal mark or surface etching, our laser glass marking systems can meet your needs. Due to its many advantages over traditional marking techniques, laser marking is found in an increasing number of industries—bringing flexibility, speed and repeatability to your application. Other advantages include: No consumables. Laser marking doesn’t require extra cons...
view more
-
UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
view more
-
Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
view more
-
UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
view more
