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Laser drilling metal offers superior speed and lower operating costs
Apr 09 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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ADVANTAGES OF LASER DRILLING OF CERAMIC
Apr 12 , 2021
Drilling ceramic using laser energy allows for fast drilling while having precise control of heat, hole placement, and hole quality. Drilling can create through-holes or partial holes for texturing or micromachining requirements. Micro drilling is possible when using short wavelength laser sources giving the ability to drill holes with diameters down to 10’s of microns. Control Micro Systems...
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15W nanosecond UV laser etches PCB board without burrs
Apr 15 , 2021
15W nanosecond UV laser etches PCB board without burrs PCB circuit board has high wiring density, small size and light weight, which is conducive to the development of smart phone electronic equipment in the direction of high density, high integration, packaging, miniaturization and multilayer; especially the bending resistance of FPC flexible boards, Precision, better application to high-p...
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15W nanosecond solid-state UV laser high-precision marking PCB FPC two-dimensional code
Apr 15 , 2021
15W nanosecond solid-state UV laser high-precision marking PCB FPC two-dimensional code, one-dimensional code, characters PCB circuit board has high wiring density, small size and light weight, which is conducive to the development of smart phone electronic equipment in the direction of high density, high integration, packaging, miniaturization and multilayer; especially the bending resistance of ...
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355nm UV laser for automatic marking of QR code on PCB/FPCB surface
Apr 15 , 2021
355nm UV laser for automatic marking of QR code on PCB/FPCB surface PCB circuit board has high wiring density, small size and light weight, which is conducive to the development of smart phone electronic equipment in the direction of high density, high integration, packaging, miniaturization and multilayer; especially the bending resistance of FPC flexible boards, Precision, better applicat...
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Using UV laser marking, Safe, non-contact etching for printed circuit boards
Apr 16 , 2021
Using UV laser marking, Safe, non-contact etching for printed circuit boards PCB marking—including etching codes, numbers and logos onto circuit boards—is necessary for inventory control and tracking. Many conventional methods, however, are time consuming and require additional consumables and cleaning processes. Our fully automated PCB laser marking systems overcome these challenges. ...
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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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