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Laser marking, cutting and welding for today’s tiny electronics
Apr 13 , 2021
LASER MARKING Electronic parts are shrinking—limiting the available real estate for part names, serial numbers and other manufacturing identifiers. Our laser marking systems overcome this challenge. Paired with vision verification, they clearly and precisely etch information onto the surfaces of electronic parts—outperforming traditional ink, decal and molding methods. LASER CUT...
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Clean, precise laser welding, marking, drilling and cutting for MDM applications
Apr 14 , 2021
MEDICAL DEVICE LASER APPLICATIONS Our Application Lab has a full suite of lasers and optics to provide you with the mark quality and accuracy demanded in the Medical Industry. The use of the ultrafast picosecond lasers provides a dark durable mark that will stand up to the environmental testing required for medical instruments. Since there are so many devices used in the Medical industry, catheter...
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Internal and external green laser marking of glass
Apr 15 , 2021
Whether you need an internal mark or surface etching, our laser glass marking systems can meet your needs. Due to its many advantages over traditional marking techniques, laser marking is found in an increasing number of industries—bringing flexibility, speed and repeatability to your application. Other advantages include: No consumables. Laser marking doesn’t require extra cons...
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Fast, flexible laser marking for pharmaceutical tablets
Apr 15 , 2021
As pharmaceutical manufacturing continues to evolve, you need tools that are readily adaptable and easy to implement. Your tablet marking systems must be able to change information quickly—adjusting to multiple shapes and sizes without halting production. Ink marking methods can smear, make contact with the tablet and require regular maintenance—adding extra steps to your manufa...
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Using UV laser marking, Safe, non-contact etching for printed circuit boards
Apr 16 , 2021
Using UV laser marking, Safe, non-contact etching for printed circuit boards PCB marking—including etching codes, numbers and logos onto circuit boards—is necessary for inventory control and tracking. Many conventional methods, however, are time consuming and require additional consumables and cleaning processes. Our fully automated PCB laser marking systems overcome these challenges. ...
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UV lasers are ideal for small, precise holes of plastic
Apr 16 , 2021
Laser technology has many advantages over traditional drilling methods. It enables more precise drilling, makes no mechanical contact with plastic parts and lets you switch between hole sizes and shapes quickly and easily. Depending on the order you need to fill, you may require different hole sizes for a specific part. Thanks to laser drilling, you can stock undrilled parts and then drill the req...
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Laser drilling of thin metals
Apr 16 , 2021
Metal drilling is an important application to many industries including automotive, aerospace, medical device manufacturing, electronics, and semiconductor manufacturing. The need to drill precise holes with minimal extra effect to the metal part is critical to producing quality products. Laser drilling has become a popular solution for metal processing due to its non-contact nature and minimal he...
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UV LASER FOR PLASTIC CUTTING
Apr 16 , 2021
Using lasers to cut plastic achieves precise, fast and repeatable cuts in many types of polymers. Compared to traditional cutting methods, laser systems offer many advantages like precise laser control, high accuracy and speed. Others include: Non-contact cuts. Lasers eliminate cleaning, sharpening and replacing cutting blades. Small kerf widths. Focused, localized laser energy creates very narrow...
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UV laser drilling of SiC for semiconductor device fabrication
Apr 19 , 2021
Pulsed UV laser processing is used to drill micro holes in silicon carbide (SiC) wafers supporting AlGaN/GaN transistor structures. Direct laser ablation using nanosecond pulses has been proven to provide an efficient way to create through and blind holes in 400 µm thick SiC. When drilling through, openings in the front pads are formed, while blind holes stop ~40 µm before the backside...
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Laser drilling of micro-holes in single crystal silicon, indium phosphide and indium antimonide using a continuous wave (CW) 1070 nm fibre laser
Apr 19 , 2021
The laser micro-drilling of “thru” holes, also known as via holes, in Si, InP and InSb semiconductor wafers was studied using millisecond pulse lengths from an IPG Laser Model YLR-2000 CW multimode 2 kW Ytterbium Fibre Laser and a JK400 (400 W) fibre laser, both with 1070 nm wavelength. The flexibility of this laser wavelength and simple pulsing scheme were demonstrated for semiconduct...
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Small Holes in Silicon Wafer
Apr 19 , 2021
Small Holes in Silicon Wafer: Microholes in silicon wafer substrate. Potomac has the capability to drill holes, channels and pockets in silicon wafers with feature sizes as small as a few microns. Please contact us today to discuss your application.
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532nm laser marker case for drilling tempered glass
Apr 20 , 2021
532nm laser marker case for drilling tempered glass
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