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Application of UV laser cutting machine in semiconductor wafer
May 21 , 2021
Application of UV laser cutting machine in semiconductor wafer In recent years, with the rapid development of the optoelectronic industry, the demand for highly integrated and high-performance semiconductor wafers has continued to grow. Materials such as silicon, silicon carbide, sapphire, glass, and indium phosphide have been widely used as substrate materials fo...
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Laser cutting is the future development direction of lithium battery processing
May 21 , 2021
Laser cutting is the future development direction of lithium battery processing Laser cutting technology is the future development direction of lithium battery processing. Laser cutting technology has the characteristics of controllable processing, high efficiency, and high quality. It has a very broad application in the industrial processing of lithium batteries. Laser...
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Laser cutting sapphire LED chip
May 21 , 2021
Laser cutting sapphire LED chip The development of LED chips continues to develop in the direction of high efficiency and high brightness. Traditional chip cutting methods such as diamond scribing and grinding wheel sawing are gradually outdated due to their low efficiency and low yield, and cannot meet the needs of modern production. At present, laser cutting met...
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The application prospects of laser cutting technology on solar cells
May 22 , 2021
The application prospects of laser cutting technology on solar cells Thin-film solar cell products can be divided into two types: crystalline silicon thin-film batteries and other thin-film batteries. The former includes monocrystalline silicon cells and polycrystalline silicon cells. Wafer cutting is the key to the production of monocrystalline silicon cells. Wir...
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Processing advantages of IC wafer semiconductor automatic laser scribing machine
May 22 , 2021
Processing advantages of IC wafer semiconductor automatic laser scribing machine A larger share of the world chip dicing market, especially in the field of non-integrated circuit wafer dicing. The diamond saw blade (grinding wheel) dicing method is currently a common wafer dicing method. , The traditional blade dicing can easily lead to wafer breakage, and the dic...
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The advantages of UV laser cutting technology in the semiconductor industry
May 22 , 2021
The advantages of UV laser cutting technology in the semiconductor industry In recent years, with the increase of device integration, chip size and cutting lane width have been shrinking accordingly. The thickness of wafers and chips is getting thinner and thinner, but due to the brittleness of semiconductor materials, traditional cutting methods will produce mech...
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Application of laser cutting in medical equipment
May 22 , 2021
Application of laser cutting in medical equipment In recent years, laser cutting has become more and more widely used in the production and application of medical devices. Due to the characteristics of high processing accuracy, fast speed, non-contact cutting, and flexible processing, laser cutting machines have become a common production tool in the medical devic...
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Laser marking or cutting electronic and semiconductor
May 26 , 2021
Laser technology has been used in the electronics for a few years now and it has helped many consumer electronics companies to provide better products for their customers. Laser marking, laser cutting is the most common technology used on electronics. High quality requirements and absolutely complete information flow in every process step are the requirements in the field of electronics. Ci...
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Laser cutting is a sheet metal processing that laser beam radars on the processing material
May 27 , 2021
Laser cutting is a sheet metal processing that laser beam radars on the processing material. Laser cutting works by directing the output of a high-power laser most commonly through optics. The laser beam can be divided into solid state and un-solid state Laser cutting is applied to metal materials such as mild steel, stainless steel, aluminum alloy, pickling plate, galvanized sheet, silicon...
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laser cutting technology in fitness equipment
May 27 , 2021
The continuous expansion of the fitness team has also brought strong business opportunities for fitness equipment manufacturers. Fitness equipment manufacturers have increased scientific and technological innovation, and strive to improve product quality, strengthen independent research and development capabilities. Treadmill, spinning bike, abdominal muscle, stretching machine, barbell bar rack, ...
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Laser cutting technology plays an irreplaceable role
May 28 , 2021
In order to meet the needs of export and domestic upgrading, small batch and variety of vehicle production has become the norm in the automobile manufacturing industry. The original general processing technology of automobile body parts can not fully meet the product quality and production needs today. Laser cutting machine has the characteristics of processing high- precision, porou...
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FPC soft board cutting with 15W high power UV laser cutting without carbonization
Jun 01 , 2021
FPC soft board cutting with 15W high power UV laser cutting without carbonization High-power UV laser cutting FPC soft board with small line width and no burrs The mainstream of laser cutting FPC soft board market uses 10-20W ultraviolet laser The coverage rate of FPC is very extensive. For example, mobile phones, digital cameras and notebook computers all need such components, and their ci...
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