High-precision UV laser marking machine

The laser marking machine has obvious advantages, such as high marking accuracy, not easy to erase and fast marking speed, and initially entered various industries. In the semiconductor industry, it is naturally inseparable from the mark.

355nm UV light source marking wafer chips

However, in the semiconductor industry, wafer-level marking is one of its special needs. Wafer-level marking is mainly applied to the wafer marking on the chip of each chip on the back of the wafer to ensure the traceability of each chip, and then cut into individual chips after marking.

High-demand nanosecond laser marking wafers

Because the wafer has been completed when the wafer is in the marking machine process, the wafer is already very valuable, so higher requirements are put forward on the marking equipment, which are mainly reflected in:

(1) Chips tend to be thinner and lighter. Different materials need to be marked with depth control, and the marked fonts are clear;

(2) The smaller the chip size, the larger the positioning accuracy and font size.

(3) The transfer and transportation of thin wafers becomes very difficult during the marking process, how to deal with this

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There are many other marking applications in the laser marking machine industry

The process becomes crucial. In recent years, due to the rise of wafer-level WL-CSP packaging, the demand for wafer-level marking has become more and more intense. Well-known laser equipment companies at home and abroad have also developed wafer-level marking equipment and alternatives. Of course, in addition to wafer-level marking, there are many other marking applications in the laser marking machine industry, such as marking the package surface after packaging, marking the serial number of the wafer, and so on.